Model & package intelligence
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muRata GJM1555C1H150FB01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GJM1555C1H150FB01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GJM1555C1H150FB01D
- Electronic Component
- 1
- Electronic Component
- 15pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±1%
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0257274325
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GJM1555C1H150FB01D 产品概述
一、产品简介
GJM1555C1H150FB01D 为村田（muRata）生产的高稳定性多层陶瓷贴片电容（MLCC），封装为 0402（约 1.0 × 0.5 mm），标称电容 15 pF，容差 ±1%，额定电压 50 V，介质类型为 C0G（也称 NP0）。该器件以温度稳定性好、介质损耗低、线性度高著称，适合对电容精度和稳定性要求严格的应用场合。
二、主要电气特性
- 电容：15 pF ±1%
- 额定电压：50 V DC
- 温度特性：C0G（0 ±30 ppm/°C 典型），温度范围宽、几乎无温漂
- 介质损耗低，适用于高 Q 值和高频环境
- 低电压依赖性（较低的 DC 偏压系数），保持容量稳定
三、典型应用场景
- 高频电路：射频匹配、滤波、调谐网络
- 精密模拟：时钟振荡、参考回路、采样保持电路
- 低噪声放大器与混频器输入输出耦合
- 仪器仪表与计量电路中对温漂和精度敏感的节点
四、封装与工艺注意事项
- 封装：0402 表面贴装，适合自动化贴片与回流焊工艺
- 推荐遵循厂方回流温度曲线和 PCB 焊盘设计，避免过度焊接热应力
- 贴片尺寸小，装配和检修时注意静电与机械压裂风险；板弯曲应尽量避免
- 建议使用厂方推荐焊盘印刷尺寸以保证可靠焊接与电性能
五、可靠性与使用建议
- C0G 介质具备优良的绝缘电阻与长时间稳定性，适合长期可靠性要求高的产品
- 虽然 C0G 的 DC 偏压效应小，但在极端电压或高温下仍需做必要的裕量设计
- 储存与搬运应防潮防尘，避免机械冲击；贴片前后遵守 ESD 保护规范
六、替代与采购提示
- 同规格（0402、15 pF、±1%、50 V、C0G）可选用其他主流厂商的 NP0/C0G 系列作为替代，采购时核对尺寸与温度系数一致性
- 村田常见包装为卷带（tape & reel），可按生产需求选择不同卷盘数量并确认包装代码与交货周期
如需具体的封装尺寸图、推荐焊盘图或回流曲线，可提供数据手册（PDF）以便详细设计与评估。
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