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muRata GRM033R71H471KA12D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM033R71H471KA12D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM033R71H471KA12D
- Electronic Component
- 1
- Electronic Component
- 470pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0257274314
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM033R71H471KA12D 产品概述
一、概述
GRM033R71H471KA12D 为村田（muRata）出品的贴片多层陶瓷电容（MLCC），标称电容值 470 pF，容差 ±10%（K），额定电压 50 V，介质材料为 X7R，封装为 0201（超小型贴片）。该型号以体积小、容量适中、温度特性稳定且工艺成熟著称，适用于空间受限的高密度电路板设计。
二、主要电气与温度特性
- 电容：470 pF ±10%（K）
- 额定电压：50 V DC
- 介质：X7R（温度范围 -55°C 至 +125°C，典型温度容差在额定范围内控制在±15%）
- 介质特性：相对于 C0G（NP0）类，X7R 在容量/体积比上更优但具有一定温漂与电压依赖性
- 注意：小尺寸 MLCC 在直流偏压下会出现显著电容量衰减（DC-bias），设计时应参考厂商的 DC-bias 曲线并留有裕量
三、优点与适用场景
- 优点：体积极小，适合高密度布局；50 V 额定提供较好耐压裕量；X7R 在宽温区间内保持较稳定的介电常数，性价比高
- 典型应用：去耦/旁路（中高频段）、滤波、阻抗匹配、频率补偿、耦合/旁路电路、便携式与物联网终端、消费电子与工业控制中的空间受限电路
四、局限与设计注意事项
- DC-bias 与温度依赖：在高偏压及极端温度下电容会下降，频繁用于时间常数或精密滤波时需评估影响
- 封装限制：0201 封装对贴装精度、焊接工艺与检修带来挑战，建议采用厂家推荐的焊盘（land pattern）并优化贴片、回流参数
- 机械强度：超小封装更易产生裂纹或焊接应力损伤，需注意板厚、贴装压力与阵列布局避免过孔附近的机械应力集中
五、可靠性与工艺建议
- 建议遵循村田提供的回流焊曲线与清洗指南；在回流及后处理过程中避免超出温度与应力限制
- 储存与搬运应防潮防静电，贴片元件宜使用原装带卷或按厂家说明保存
- 在关键应用中，参考厂商的温度-电容与 DC-bias 曲线进行裕量设计，并在样机验证阶段做环境与电压应力测试
六、替代与选型建议
- 若需更高温度稳定性或精密特性，可考虑 C0G(NP0) 型电容，但体积与容量密度将下降
- 同类替代可在规格相近的其他品牌（如 TDK、村田其他尺寸/系列、Taiyo Yuden 等）中查找 470 pF、50 V、X7R、0201 的等效件，选型时以 DC-bias 曲线、寿命/可靠性数据和封装一致性为准
总结：GRM033R71H471KA12D 以其超小封装与适中的电气特性，适合现代高密度电路中的通用去耦与滤波应用。在设计时需特别关注 DC-bias 效应与封装带来的工艺约束，并遵循村田的装配与回流建议以保障长期可靠性。若需更详细的曲线或推荐的焊盘尺寸，可提供厂商数据表以供参考。
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