Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM033R61C104KE84D 是由村田制作所(muRata)生产的一款高性能多层陶瓷电容(MLCC),适用于各种电子设备中的通用应用。以下是对此产品的详细介绍。
GRM033R61C104KE84D 采用 X5R 温度系数,这意味着在 -55°C 到 85°C 的温度范围内,电容值的变化不会超过 ±15%。这种高稳定性使其非常适合需要在广泛温度范围下保持性能的应用。
该电容采用 0201 封装(0603 公制),尺寸为 0.60 mm x 0.30 mm x 0.33 mm。这使得它非常适合现代电子设备中的空间有限的设计,能够实现高集成度和紧凑的布局。
工作温度范围从 -55°C 到 85°C,这使得 GRM033R61C104KE84D 可以在各种环境条件下运行,包括极端冷热环境。这种特性特别适用于汽车电子、工业控制和其他需要在恶劣环境下运行的设备。
作为村田制作所的一款产品,GRM033R61C104KE84D 符合严格的质量控制标准和行业认证要求。村田制作所是全球知名的电子元器件制造商,其产品以高品质和可靠性著称。
GRM033R61C104KE84D 适用于各种通用应用,包括但不限于:
GRM033R61C104KE84D 采用表面贴装技术,需要使用适当的焊接工艺以确保良好的接触和可靠性。建议遵循制造商提供的焊接指南。
在使用 GRM033R61C104KE84D 时,必须确保不超过其额定电压(16 V)和工作温度范围(-55°C ~ 85°C)。超出这些限制可能导致电容损坏或失效。
GRM033R61C104KE84D 是一款高性能、通用多层陶瓷电容,具有小尺寸、宽泛工作温度范围和高稳定性。它广泛应用于各种电子设备,包括汽车电子、工业控制和消费电子等领域。通过选择此产品,设计工程师可以确保他们的系统具有高可靠性和稳定性。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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