WMSIC Electronic Components

muRata GRM155R71C224KA12D

muRata GRM155R71C224KA12D
1 / 2

Product image

ModelGRM155R71C224KA12D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM155R71C224KA12D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM155R71C224KA12D
Electronic Component
1
Electronic Component
220nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0090954637
Electronic Component
X7R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述：muRata GRM155R71C224KA12D 贴片电容

基本信息

  • 产品型号：GRM155R71C224KA12D
  • 类型：多层陶瓷电容（MLCC）
  • 电容值：0.22µF
  • 电压额定值：16V
  • 容差：±10%
  • 温度系数：X7R
  • 工作温度范围：-55°C 至 +125°C
  • 封装类型：0402（1005公制）
  • 尺寸：1.00mm x 0.50mm（长 x 宽）
  • 最大厚度：0.55mm
  • 品牌：村田（muRata）

产品描述 GRM155R71C224KA12D 是由村田（muRata）制造的一款高性能多层陶瓷贴片电容（MLCC），其电容值为0.22µF，额定电压为16V。它采用 X7R 温度系数材料，适合多种电子电路应用。X7R 材料的优点在于其在宽广的温度范围内能够保持良好的电容稳定性，且其额定工作温度范围是从-55°C到+125°C，使其在极端环境下依然能保持良好的工作性能。

应用领域 由于其出色的性能参数，GRM155R71C224KA12D被广泛应用于各类电子设备中，尤其是在高频电路和高密度表面贴装技术（SMT）中。典型的应用场景包括：

  1. 消费电子：如智能手机、平板电脑和其他便携式设备，需小型化、轻量化且高效的元器件。

  2. 计算机与服务器：在母板和其他电路板中作为去耦电容，帮助抑制电源噪声，提高电源的稳定性。

  3. 工业设备：由于其广泛的工作温度范围，使其适合应用于各种工业控制系统。

  4. 汽车电子：在汽车传感器系统、控制模块及其他关键应用中，可靠性和稳定性至关重要。

性能特点

  1. 高稳定性：得益于其采用的 X7R 材料，GRM155R71C224KA12D 提供了在较大温度变化下，电容值变化较小的特性，非常适合用于高稳定性要求的应用。

  2. 小型化设计：0402封装确保了该电容的极小尺寸，对于空间有限的设计尤为重要。

  3. 高频性能：这一系列电容在高频下的低等效串联电阻（ESR）特性，能够有效降低信号失真，提升电路的整体性能。

  4. 可靠性：村田在制造过程中，对材料的选择和工艺的控制非常严格，确保每一颗电容都能在严格的标准下生产，提供高可靠性的稳定表现。

安装与兼容性 GRM155R71C224KA12D 采用表面贴装安装方式，便于自动化生产线的应用，尤其是在现代电子产品中，该电容可以与其他表面贴装元件（如电阻、Inductor 等）进行完美匹配，满足大规模生产和设计需求。

结论 muRata GRM155R71C224KA12D 贴片电容以其出色的电气性能、可靠的热稳定性以及紧凑的封装形式，成为广泛应用于消费电子、计算机、工业设备及汽车电子等多个领域的理想选择。其高效率和高可靠性，更是现代电子设计不可或缺的重要元件之一。选择 GRM155R71C224KA12D，您可以充分信任其在各种严苛环境下的表现，助力电子产品的性能提升与稳定运营。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.