Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata BLM15AG121SN1D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata BLM15AG121SN1D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- BLM15AG121SN1D
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0000000388
- Operating Temperature
- 55℃~+125℃
- Current
- 550mA
- @Frequency
- 120Ω@100MHz
- Resistor(DCR)
- 190mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BLM15AG121SN1D 产品概述
BLM15AG121SN1D 是由著名电子元器件制造商村田（muRata）生产的一款高性能磁珠，专为满足现代电子设备中日益增长的信号完整性和电源管理要求而设计。其核心功能是提供良好的抑制高频噪声以及稳定的阻抗特性，为用户提供了一种有效的 EMI（电磁干扰）过滤解决方案。
主要性能参数
阻抗特性：
- 在100MHz频率下，BLM15AG121SN1D 具有120Ω的阻抗特性，这使其非常适合用于高速数据传输的应用场景，如 USB、HDMI 和以太网接口等。良好的阻抗匹配可有效降低信号反射，并提高信号传输的稳定性和可靠性。
直流电阻（DCR）：
- 此磁珠的最大直流电阻（DCR）为190毫欧。较低的直流电阻保证了在传输过程中能量损耗最小化，有助于提高整体系统的能效，尤其在高电流环境下表现尤为突出。
额定电流：
- BLM15AG121SN1D 可支持最高550mA的额定电流。这一参数确保了在各种实际应用中，尤其是在对电流有较高要求的场合，该磁珠依然能够稳定工作，满足设计需求。
工作温度范围：
- 此产品的工作温度范围为 -55°C 到 125°C，极大地扩展了其应用场景。无论是在严苛的室外环境，还是在高温、高湿的工业环境中，BLM15AG121SN1D 均能保持稳定性能，确保设备的可靠性。
封装规格
BLM15AG121SN1D 采用0402（1005 公制）封装类型，其尺寸为0.039"（长）x 0.022"（宽），高度为0.022"（0.55mm），这使其非常适合应用于空间受限的电子产品中。表面贴装（SMD）设计简化了整体电路板布局，提高了PCB（印刷电路板）的组装效率。
应用领域
由于其出色的电气性能和广泛的工作温度范围，BLM15AG121SN1D 被广泛应用于多个领域，具体包括：
- 通信设备：在智能手机、平板电脑等消费电子中，为避免干扰，确保数据清晰传输，起到重要作用。
- 计算机与外设：在计算机的主板及外接设备中，可有效抑制 EMI，提供清晰、稳定的信号。
- 工业设备：在各种工业自动化设备中，能够在极端环境下稳定工作，确保设备高效运行。
- 汽车电子：随着汽车电子化的发展，该磁珠在车载通讯、导航等系统中也展现出良好的应用潜力。
结论
综上所述，BLM15AG121SN1D 磁珠凭借其优异的电气性能、广泛的应用范围和可靠的工作特性，一直以来是设计工程师在抗干扰和信号完整性方面的理想选择。无论是用于消费电子、通讯、工业还是汽车领域，这款磁珠都展现出其出色的价值，帮助用户有效克服现代电子设计中的各种挑战与难题。选择 BLM15AG121SN1D，就是选择了品质与性能的保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
