WMSIC Electronic Components

muRata GRM1555C1H331JA01D

ModelGRM1555C1H331JA01D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM1555C1H331JA01D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM1555C1H331JA01D
Electronic Component
1
Electronic Component
330pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0227634159
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM1555C1H331JA01D 产品概述

一、产品简介

GRM1555C1H331JA01D 是村田(muRata)出品的一款高稳定性多层陶瓷贴片电容(MLCC),额定容量为 330 pF,额定电压 50 V,温度特性为 C0G(NP0),公差 ±5%,封装为 0402(美国惯例称 0402,公制约 1005)。该型号以介质稳定、损耗低、频率特性好著称,适合对电容精度和温度稳定性要求较高的设计场合。

二、主要电气性能

  • 容值:330 pF
  • 额定电压:50 V DC
  • 温度特性:C0G / NP0(近零温度系数,温度下性能极为稳定)
  • 精度:±5%(J)
  • 封装:0402 SMD
  • 典型特性:低介质损耗、低等效串联电阻/电感(ESR/ESL)、极小的电压依赖性和几乎无老化效应

三、性能特点与优势

C0G(NP0)介质本质上属于一类线性、近乎零温度系数的材料,随温度变化电容值几乎不变,损耗极低,适合需要高 Q 值和稳定相位、频率响应的应用。与类二陶瓷(如 X7R、X5R)相比,本型号在温漂、老化和直流偏置下的容量变化非常小,提供长期稳定的电气行为。

四、典型应用场景

  • 高频滤波、射频匹配网络与阻抗调节
  • 振荡器、谐振电路和时间基准电路(需高稳定度电容)
  • 模拟前端、A/D 转换器旁路与精密滤波器
  • 电容耦合与阻抗补偿场合
  • 需要低损耗与低相位误差的通信设备及测量仪器

五、封装与可靠性注意事项

0402 小尺寸有利于减小寄生量并提高装配密度,但在装配和板面应力上相对敏感。该型号适用于标准回流焊工艺(请按厂商建议的焊接温度曲线操作),建议在 PCB 设计时避免在焊盘附近出现过大的机械应力、控制焊盘尺寸与焊膏量以获得良好焊接应力分布。C0G/NP0 几乎无老化,但仍需考虑热循环与机械应力对长期可靠性的影响。

六、选型与使用建议

  • 直流偏置:C0G 对 DC 偏置敏感性低,常温下 50 V 工作时容量衰减很小,但高压下仍建议留有裕量(电压降额)。
  • 布局建议:用于高频或高精度线路时,尽量靠近信号源或器件引脚布置,减少走线寄生;接地焊盘良好回流以减少 EMI。
  • 机械防护:避免板弯曲和强烈热冲击;0402 尺寸虽小但相对脆性,设计焊盘与过孔时注意应力释放。
  • 替代与采购:同类规格可参考其他厂商的 NP0/C0G 0402 产品,选型时核对容量、额定电压、温漂与封装一致性;订购时留意包装格式(卷带、盘带)与厂家出厂代码。

七、总结

GRM1555C1H331JA01D 以其 C0G(NP0)介质的高稳定性、低损耗特性和 0402 的小型化封装,适合对频率特性与温度稳定性要求高的精密电子电路。合理的 PCB 布局与焊接工艺、适当的电压裕量和机械防护,将确保该电容在长期工作中的可靠性与性能稳定。若需更详细的电气特性曲线与焊接参数,建议参考村田官方数据手册或向供应商索取样片测试。

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