Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM31M5C1H473JA01L是一款高性能表面贴装多层陶瓷电容(MLCC),由知名电子元器件制造商muRata(村田)生产。该电容具有电容值为0.047µF,电压额定值为50V,且容差为±5%。作为C0G(NP0)温度系数电容器,它非常适合在要求稳定性的应用场景中使用。该产品的工作温度范围是-55°C至125°C,确保能够在多种环境条件下稳定工作。
电容值与容差:GRM31M5C1H473JA01L的电容值为0.047µF,容差控制在±5%,这种小容量电容通常用于高频电路或滤波应用中,能够有效地减少电源噪声并提升信号质量。
额定电压:该电容器的额定电压为50V,意味着其可承受的最大直流电压为50V。由于其高额定电压,该电容适合用于高电压电源电路和信号耦合。
温度特性:作为C0G/NP0类型的电容,它具有很好稳定的温度系数,意味着在不同温度下其电容值变化很小,适合在温度变化较大的环境中使用,例如汽车电子、工业控制及航空航天设备等。
工作温度范围:-55°C至125°C的宽广工作温度范围使该电容能够在苛刻环境下持续工作,非常适合要求严格的工程应用。
封装与尺寸:以1206(3216公制)形式封装,尺寸为3.20mm x 1.60mm,厚度最大为1.25mm。该小型化设计使得其可以在尺寸有限的应用中有效使用,例如智能手机、平板电脑及其他便携式电子设备。
GRM31M5C1H473JA01L电容的多功能性使其可以广泛应用于多种电子产品中,包括:
作为行业领先品牌的muRata,GRM31M5C1H473JA01L产品在品质与可靠性上具有显著优势。MuRata的电容产品设计与制造遵循严格的国际标准,确保其在高要求环境中的长效工作能力。
GRM31M5C1H473JA01L是一个完美结合了小型化、稳定性和高额定电压的高品质多层陶瓷电容器。无论是在满足高频特性、工作温度或抗电压能力方面,它都能为电子设计师提供可靠的解决方案,是现代电子设备不可或缺的关键元件之一。对于对性能以及尺寸有苛刻要求的应用领域,该电容器无疑是一个优秀的选择。无论是消费电子、汽车电子,还是高端工业应用,GRM31M5C1H473JA01L都是值得推荐的产品。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products