Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GCM188R71H473KA55D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GCM188R71H473KA55D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GCM188R71H473KA55D
- Electronic Component
- 1
- Electronic Component
- 47nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0000281309
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GCM188R71H473KA55D 产品概述
GCM188R71H473KA55D 是一款由知名电子元器件制造商村田（muRata）出品的表面贴装多层陶瓷电容器（MLCC）。该电容器设计用于汽车应用，符合 AEC-Q200 标准，确保其在严苛环境下的可靠性和稳定性。该产品的多个参数，使其在各种电子线路中扮演着至关重要的角色，特别是在电源管理、信号耦合、滤波和去耦合领域。
产品基本参数
电气特性：
- 容值：47nF，适合在高频和低频应用中使用，能够有效地控制电路中的噪声及干扰。
- 电压额定值：50V，使其能在较高电压的环境中工作，提供了良好的安全裕度。
温度系数与温漂：
- 使用X7R介质材料，具备较好的温度稳定性，适用于-55°C至125°C的宽温工作环境。这使得GCM188R71H473KA55D在各种气候条件下都能正常工作。
- 温漂系数适合在温度变化大且电容稳定性要求高的场合使用。
精度与容差：
- 精度为±10%，这一规格使得其在较严格的应用环境中依然能够保证不错的电容性能。
机械特性：
- 封装类型：0603规格（1.6mm x 0.8mm x 0.9mm）的表面贴装封装，适合自动化的贴装工艺，是现代电子设备中常见的封装形式，节省了电路板空间。
- 这种小型化设计使其能够在便携式电子设备中广泛应用。
应用类型：
- 由于具备AEC-Q200认证，GCM188R71H473KA55D特别适合汽车电子系统中的使用场景，包括但不限于电源滤波、信号耦合和微控制器去耦合等应用。此外，它还可用于其它工业环境，保证设备在高温和振动等严苛条件下的可靠运行。
应用领域
GCM188R71H473KA55D 作为一种优质的汽车级 MLCC，广泛应用于以下几个领域：
- 汽车电子：适用于汽车中的电源管理模块、音频系统、车载信息娱乐系统及传感器。
- 消费电子：其小巧的尺寸使其适合在智能手机、平板电脑和其他便携式设备中使用。
- 工业设备：用于各类工业控制板中，以保证电源的稳定性和信号的清晰性。
竞争优势
GCM188R71H473KA55D 的设计和制造使其在市场中拥有众多竞争优势：
- 温度和电压稳定性：具备极佳的温度和电压特性，使其在高温环境中的性能保持良好。
- 高可靠性：符合AEC-Q200标准，确保电容器在长时间工作中的稳定性，适用于汽车等应用领域。
- 小型化设计：0603的封装设计适应快速发展的电子产品小型化趋势，方便在高密度电路板上布局。
结论
综上所述，GCM188R71H473KA55D 是一款高性能、可靠性强且适用于多种应用场景的表面贴装电容器。其卓越的电气特性和机械特性，使其成为现代电子设备尤其是汽车电子系统中的理想选择。村田凭借其在电容器制造领域的丰富经验和技术积累，为用户提供了稳定可靠的产品解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
