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muRata GRM1555C1H561JA01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM1555C1H561JA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM1555C1H561JA01D
- Electronic Component
- 1
- Electronic Component
- 560pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0058401981
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM1555C1H561JA01D 产品概述
一、主要参数
GRM1555C1H561JA01D（muRata）为片式多层陶瓷电容（MLCC），主要参数如下：
- 容值：560 pF（561 表示 560pF）
- 精度：±5%（J）
- 额定电压：50 V DC
- 温度特性：C0G / NP0（一级介质，温度系数极小，行业典型约 0±30 ppm/°C）
- 封装：0402（公制 1005）SMD
- 类型：多层陶瓷，C0G（Class 1）低损耗、低温漂
二、产品特性
- 温度稳定性高：C0G（NP0）介质在宽温区间内电容几乎不变，适合对温度漂移敏感的精密电路与定时、谐振电路。
- 低损耗、高 Q 值：介质损耗小，等效串联电阻（ESR）低，适合高频应用与滤波、射频前端使用。
- 封装体积小：0402 小尺寸，利于高密度装板与面积受限的移动设备、可穿戴产品设计。
- 良好的重复焊接和可靠性：适用于常规回流工艺（请遵循制造商指定的回流曲线和焊接条件）。
三、封装与装配注意
- 安装：适用于自动贴装与回流焊接，建议参考 muRata 推荐的 PCB 焊盘尺寸与回流曲线，避免超温或过长保温时段。
- 机械应力敏感：在波峰或回流后避免对装配面施加弯曲和强烈机械应力，避免裂纹导致电容失效。
- 储存与回流次数：遵循制造商关于湿敏等级（MSL）和回流次数的说明，必要时进行烘烤以防吸湿后回流引起裂纹。
四、典型应用
- 高频与射频电路：谐振回路、谐振器、RF 匹配与滤波。
- 精密模拟电路：参考电路、采样保持、ADC 前端、滤波与定时电路。
- 时钟与振荡器：用于稳定振荡频率的谐振元件。
- 小型便携设备与通信设备：由于体积小且温漂低，适合高密度板和性能敏感的系统。
五、选型与设计建议
- 若电压应力较高或需要更大容值，请在同系列或其他介质中选用更高额定电压或更大封装型号；在容值、体积与温度特性之间权衡。
- 对于需要极低温漂与高频性能的场合，优先选择 C0G/NP0；对于需要更高容值且允许温漂增加的场合，可考虑 X7R、X5R 等介质。
- 设计 PCB 布局时，尽量缩短高频回路的走线和旁路路径，减少引线电感影响；贴片方向和焊盘设计应参考 muRata 的应用说明。
备注：以上为基于 GRM1555C1H561JA01D 常见特性与应用的概述。具体电气参数（如温度特性范围、等效串联电容/电阻、回流工艺参数及可靠性试验数据）请参考 muRata 官方规格书和应用笔记以获得详尽和最新信息。
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