WMSIC Electronic Components

muRata GRM21BR61E475KA12L

ModelGRM21BR61E475KA12L
Package0805
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM21BR61E475KA12L
Type
MURATA
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM21BR61E475KA12L
Electronic Component
1
Electronic Component
4.7uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.037g
Electronic Component
1
Electronic Component
BM0000286871
Electronic Component
X5R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:GRM21BR61E475KA12L

GRM21BR61E475KA12L 是一款由知名电子元件制造商村田(muRata)生产的贴片陶瓷电容器,属于多层陶瓷电容器(MLCC)系列。这款电容器以其优异的性能和稳定的电气特性,广泛应用于各类电子设备中,特别是在对体积和电性能要求较高的应用场合。

1. 基础参数

GRM21BR61E475KA12L 的主要参数包括:

  • 容值:4.7 µF,提供了良好的电容值,适用于去耦、滤波及储能等多种应用。
  • 额定电压:25V,适合在日常电子电路中进行可靠的电力管理。
  • 温漂系数:采用 X5R 介质材料,使得电容器在不同温度下能够保持相对稳定的性能,适合 -55°C 到 85°C 的广泛工作温度范围。

2. 封装与尺寸

GRM21BR61E475KA12L 采用0805(2012公制)封装,尺寸为 2.00mm x 1.25mm,厚度最大为 1.35mm。这种小型封装使得电容器在电路板上的布局更为灵活,适应现代电子产品日益缩小的体积需求。

3. 精度与容差

该电容器的精度为 ±10%,在实际应用中能够满足大多数设计需求。精确的容值和容差使得工程师在设计电路时能够更好地把握电路性能,确保其在各种条件下的可靠性。

4. 典型应用场景

GRM21BR61E475KA12L 由于其多样化的特点,被广泛应用于以下领域:

  • 消费电子:如智能手机、平板电脑、可穿戴设备等,帮助提升电源管理效率及信号稳定性。
  • 工业设备:在工业控制系统中,提供稳定的电源去耦,确保设备长时间稳定运行。
  • 汽车电子:对温度变化敏感的环境下,该电容器能够保持性能,为汽车电子系统提供必要的支持。
  • 通信设备:提高信号的稳定性和抗干扰能力,增强通信质量。

5. 设计与安装

GRM21BR61E475KA12L 的表面贴装(SMD)形式使得其在电路板的自动化生产中更为便利。使用回流焊技术可以确保电容器的稳固安装,减少人工干预及错误,提升生产效率。

6. 性能优势

GRM21BR61E475KA12L 的 X5R 温度特性使得其在温度变化(如高温、低温及相对湿度环境)下仍能保持稳定的电容值,是高可靠性应用中的理想选择。此外,其小型化的设计不仅减少了电路板空间的占用,同时有效降低了串联电阻(ESR),提升了电路的整体性能。

7. 结论

GRM21BR61E475KA12L 以其高性能、可靠性及灵活应用在现代电子设计中表现出色。无论是用于消费电子、工业控制还是汽车电子,这款电容器都能为设计师提供稳定的性能支持。凭借村田品牌所代表的高品质和创新技术,GRM21BR61E475KA12L 无疑是当前电子设备理想的电容解决方案。无论是设计新产品还是替换现有组件,此款电容器都将是一个值得信赖的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.