WMSIC Electronic Components

muRata LQP03HQ10NH02D

ModelLQP03HQ10NH02D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
mu Rata LQP03HQ10NH02D
Type
MURATA
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
LQP03HQ10NH02D
Electronic Component
1
Package
0201
Electronic Component
SMD Inductor
Electronic Component
±3%
Electronic Component
0.008g
Inductor
10nH
Electronic Component
1
Factor
20@500MHz
Electronic Component
BM0259012914
Current
300mA
Frequency
4.5GHz
Resistor(DCR)
400mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LQP03HQ10NH02D 产品概述

一、产品简介

LQP03HQ10NH02D 为 muRata(村田)系列高Q贴片电感,采用超小型 0201 封装设计,面向高频射频及空间受限的便携式电子产品。该器件以稳定的电感值和良好的品质因数著称,适用于高精度阻抗匹配、谐振回路及高频滤波等场景。

二、主要参数

  • 电感值:10 nH,公差 ±3%
  • 额定电流:300 mA
  • 直流电阻(DCR):400 mΩ
  • 品质因数(Q):20 @ 500 MHz
  • 自谐振频率(SRF):4.5 GHz
  • 封装:0201(超小型贴片)
  • 品牌:muRata(村田)
    以上指标体现了器件在数百兆赫至数吉赫范围内的良好高频性能与稳定性。

三、性能特点

  • 高精度:±3% 的电感公差适合对频率与相位要求较高的射频网络与匹配电路。
  • 高Q 值:在 500 MHz 时 Q≈20,损耗小,适合用作低损耗匹配元件与谐振器。
  • 宽频带适用:SRF 4.5 GHz,保证在 GHz 级别频段下仍能正常工作(使用时应确保工作频率远低于 SRF 以避免寄生效应)。
  • 小尺寸:0201 封装利于高密度布板与减小走线寄生,有利于移动终端、蓝牙/Wi‑Fi 等微型天线匹配。

四、典型应用

  • 手机、平板等移动终端的射频匹配网络与带通/带阻滤波器。
  • 无线模块(Wi‑Fi / BT / GNSS / IoT)的小型滤波与阻抗匹配。
  • 高频信号链的谐振回路、阻抗变换和微带线补偿。
  • 对电流要求不高的 EMI 抑制与滤波场合(注意额定电流限制)。

五、选型与注意事项

  • 电流与 DCR:400 mΩ 的 DCR 与 300 mA 额定电流表明该件不适合作为大电流电源电感,主要用于信号链或小电流偏置。
  • 频率匹配:实际工作频率应远低于 SRF,若工作接近 GHz 级别建议参考实际频率响应曲线并做仿真验证。
  • 温漂与功率:在高温或高功率条件下电感值可能发生偏移,应评估环境温度及热量累积对性能的影响。
  • 封装处理:0201 体积极小,贴装时需注意回流焊工艺及贴装精度,避免机械应力导致电气特性变化或损坏。

六、封装、焊接与储存建议

  • 推荐遵循厂商回流焊曲线与储存防潮等级(MSL)要求,装配前回收潮气敏感元件并做好烘烤预处理(若超过保质期)。
  • 焊接时保持短且直接的过渡走线以降低寄生电感/电容影响;放置位置应避免靠近大电流轨或强噪声元件。
  • 储存与运输注意防潮、防碰撞,避免在高温或强振动环境中长期保存。

如需更详细的频率响应曲线、等效电路模型或回流焊曲线,请提供设计频段与使用环境,我可以帮助匹配仿真数据与布局优化建议。

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