WMSIC Electronic Components

muRata GRM1555C2A102JE01D

ModelGRM1555C2A102JE01D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM1555C2A102JE01D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM1555C2A102JE01D
Electronic Component
1
Electronic Component
1nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0259364909
Electronic Component
C0G
Voltage
100V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM1555C2A102JE01D 产品概述

一、产品简介

GRM1555C2A102JE01D 为 muRata(村田)生产的一款高稳定性贴片多层陶瓷电容(MLCC),标称容量 1 nF,精度 ±5%,额定电压 100 V,温度特性为 C0G(又称 NP0)。该器件采用 EIA 0402(约 1.0 mm × 0.5 mm)超小封装,适合空间受限且对温漂、损耗有较高要求的电子设计。

二、主要参数

  • 容值:1 nF(102)
  • 精度:±5%(J)
  • 额定电压:100 V
  • 温度特性:C0G / NP0(近似零温度系数,温漂极小)
  • 封装:0402(表贴)
  • 品牌:muRata(村田)

三、特性与优势

  • 温度稳定性优异:C0G/NP0 材料在宽温区间内电容变化极小,适合时间常数、振荡器和高精度滤波电路。
  • 低损耗、高 Q 值:介质损耗低,适合高频及射频应用,能降低信号衰减和相位误差。
  • 小型化:0402 封装便于高密度 PCB 布局,适合便携设备和空间受限场合。
  • 耐压较高:100 V 额定电压提供更大的安全裕量,可用于中小电源及隔离电路。

四、典型应用场景

  • 高频滤波与阻容网络(RF 匹配、耦合/去耦)
  • 石英/振荡器负载电容、定时电路(RC 时间常数)
  • 高精度模数/数模前端(ADC/DAC)旁路与耦合
  • 尺寸受限的便携电子、仪器仪表以及要求稳态特性的工业电子

五、选型与使用注意事项

  • 若电路工作温度或偏压变化较大,C0G 为首选;对更大电容需求或体积限制可考虑其它介质。
  • 实际在电路中工作电压不应长期接近额定电压,建议预留裕量以降低介质吸收和电容漂移。
  • 0402 尺寸操作时需注意贴片和回流工艺对失效的影响,避免过度机械应力。

六、焊接与可靠性建议

  • 支持无铅回流焊,但应遵循厂商推荐回流温度曲线和工艺窗口。
  • 贴装前后按厂商防潮包装要求保存,若受潮需按建议进行回流前烘烤处理以防炸裂。
  • 设计 PCB 时注意减少焊盘引脚处的过大机械应力和热冲击,避免板弯曲导致的裂纹。

七、结论

GRM1555C2A102JE01D 以其优异的温度稳定性、低损耗特性和微小封装,适用于高精度、宽频带与空间受限的设计场合。选用时应综合考虑工作电压裕量、焊接工艺和存储防潮等因素,以确保长期可靠性与性能稳定。若需替代型号或批量采购建议联系 muRata 或授权分销商获取完整规格书与可靠性数据。

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