WMSIC Electronic Components

muRata GJM1555C1H150JB01D

ModelGJM1555C1H150JB01D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GJM1555C1H150JB01D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GJM1555C1H150JB01D
Electronic Component
1
Electronic Component
15pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0084326483
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GJM1555C1H150JB01D 产品概述

一、产品简介

GJM1555C1H150JB01D 为村田(muRata)生产的一款贴片多层陶瓷电容(MLCC),标称电容为 15 pF,容差 ±5%,额定电压 50 V,温度系数为 C0G。封装为 0402(公制约 1005),适用于对容量稳定性和低损耗有较高要求的小型化电路。

二、主要特性

  • 温度特性:C0G(Class 1)介质,温度系数接近零,具备优良的温度稳定性和线性度。
  • 损耗与品质因数:介质损耗极低,Q 值高,适合高频及射频电路应用。
  • 稳定性:在温度、频率与偏压变化下电容量变化小,适用于对时基、滤波与匹配精度要求高的场合。
  • 小型化:0402 封装利于高密度布板和降低电感寄生,便于移动设备及微型模块集成。

三、电气参数与机械规格

  • 标称电容:15 pF
  • 容差:±5%(J)
  • 额定电压:50 V DC
  • 温度系数:C0G(近零温漂)
  • 封装:0402(机身尺寸小,典型用于表面贴装生产工艺)
    (以上参数为型号关键规格,具体电气特性如绝缘电阻、击穿电压、频率响应等请参照厂商规格书)

四、典型应用场景

  • 射频前端:匹配电路、阻抗变换与滤波网络。
  • 振荡器与时基电路:容值稳定性对频率精准度决定性影响的场合。
  • 精密滤波与耦合:需要低损耗、低温漂的高频耦合/旁路元件。
  • 小型化电子设备:移动终端、无线模块、传感器节点等对体积与性能双重要求的产品。

五、选型建议

  • 若电路工作在高频或对相位噪声敏感,应优先选用 C0G/NP0 类型以保证稳定性。
  • 若需更高工作电压或更大容值,考虑同系列更高额定电压或更大尺寸封装以降低压电效应与电场应力。
  • 在对温度或老化极为敏感的应用,建议查看厂商试验数据(温度循环、湿热、偏压稳定性)并做板级验证。

六、封装与焊接注意事项

  • 0402 封装体积小,贴片与回流焊工艺需严格控制温度曲线与焊膏用量,避免热冲击与机械应力导致芯片裂纹。
  • 防静电、防潮处理与合理存储(按厂商建议的包装与环境)有助于保持可靠性。
  • 在 PCB 设计时注意避免在焊盘周围产生过大应力集中,推荐使用厂商推荐的焊盘尺寸与贴装工艺参数。

七、结论

GJM1555C1H150JB01D 以其 C0G 介质的高稳定性、低损耗特性和 0402 小型化封装,适合对电容稳定性、频率响应与空间要求严格的高频与精密电子应用。选型时应结合电压、频率及工作环境做综合评估,并参考村田完整规格书与可靠性测试数据以保证最终系统性能。若需替代或更详细的电气/可靠性数据,可向村田索取规格书或样品进行评估。

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