WMSIC Electronic Components

muRata GRM0335C1H470JA01D

ModelGRM0335C1H470JA01D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM0335C1H470JA01D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM0335C1H470JA01D
Electronic Component
1
Electronic Component
47pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0252997547
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM0335C1H470JA01D 产品概述

概要

GRM0335C1H470JA01D 是由村田(muRata)生产的多层陶瓷电容(MLCC),属于通用应用范围的贴片电容。以下是对此产品的详细介绍。

基础参数

  • 电容值: 47 pF
  • 容差: ±5%
  • 电压 - 额定: 50 V
  • 温度系数: C0G,NP0
    • C0G 和 NP0 是指该电容的温度系数,表示其在不同温度下的稳定性。C0G 和 NP0 类型的电容具有极低的温度系数,通常在 -55°C 到 125°C 的范围内变化非常小,适用于需要高稳定性的应用。
  • 工作温度: -55°C ~ 125°C
    • 这个广泛的工作温度范围使得 GRM0335C1H470JA01D 适用于各种环境和应用场景,从极寒到高温环境。
  • 应用: 通用
    • 该电容器适用于各种电子设备中的通用应用,包括滤波、耦合、旁路等。

封装和尺寸

  • 安装类型: 表面贴装(SMD)
    • 该电容采用表面贴装技术,方便在 PCB 上进行自动化安装和焊接。
  • 封装/外壳: 0201(0603 公制)
    • 封装尺寸为 0201(或称为 0603 公制),即长度为 0.60 mm,宽度为 0.30 mm,厚度最大值为 0.33 mm。
    • 这种小尺寸的封装使得它非常适合于现代电子产品中的空间有限的设计。

物理特性

  • 大小 / 尺寸:
    • 长度:0.024" (0.60 mm)
    • 宽度:0.012" (0.30 mm)
    • 厚度(最大值):0.013" (0.33 mm)
  • 这些精确的尺寸确保了在 PCB 设计和生产过程中能够精确匹配和安装。

品牌与可靠性

  • 品牌: 村田(muRata)
    • 村田是一家全球知名的电子元器件制造商,享有良好的声誉和质量保证。选择村田产品可以确保您获得高可靠性和高性能的元器件。

应用场景

GRM0335C1H470JA01D 因其优异的性能和小尺寸,广泛应用于以下领域:

  • 通信设备: 手机、无线路由器、基站设备等。
  • 消费电子: 智能家居设备、穿戴设备、平板电脑等。
  • 汽车电子: 汽车音响系统、导航系统、安全系统等。
  • 工业控制: 工业控制板、传感器系统、自动化设备等。

优势

  1. 高稳定性:
    • 由于采用 C0G 和 NP0 材料,GRM0335C1H470JA01D 在广泛的温度范围内保持极低的容量变化,确保了系统的稳定运行。
  2. 小尺寸:
    • 0201 封装使得它非常适合于空间有限的现代电子产品设计。
  3. 高可靠性:
    • 由村田生产,保证了产品的质量和可靠性。
  4. 通用应用:
    • 适用于各种电子设备中的通用应用,包括滤波、耦合、旁路等场景。

总结

GRM0335C1H470JA01D 是一款高性能、通用应用的多层陶瓷电容,具有优异的温度稳定性、紧凑的尺寸以及高可靠性。它广泛应用于通信设备、消费电子、汽车电子和工业控制等领域,成为现代电子设计中的理想选择。选择此产品可以帮助您实现系统的稳定运行和高效性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.