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muRata GRM1555C1H2R2BA01D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GRM1555C1H2R2BA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM1555C1H2R2BA01D
- Electronic Component
- 1
- Electronic Component
- 2.2pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0257279569
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM1555C1H2R2BA01D 产品概述
一、产品简介
GRM1555C1H2R2BA01D 为村田（muRata）出品的贴片多层陶瓷电容（MLCC），标称容量为 2.2 pF，额定电压 50 V，封装为 0402（公制 1005）。该系列产品适用于体积紧凑、对寄生参数和温度稳定性有要求的高频与通用电子电路，是移动设备、射频模块、滤波及振荡电路常用的微小容量元器件。
二、主要参数
- 容值：2.2 pF
- 额定电压：50 V DC
- 封装：0402（超小型 SMD）
- 类型：多层陶瓷电容器（MLCC）
- 品牌：muRata（村田）
（注：更多细化参数如温度特性、容差、介电常数等级及绝缘电阻请参考厂商数据手册以确保设计匹配。）
三、性能特点
- 体积小、密度高：0402 封装便于高密度组装，节省 PCB 面积。
- 高频响应好：2.2 pF 属于微小电容值，具有较高的自谐频率，适合高频信号处理、匹配与谐振电路。
- 低损耗、低寄生：良好的等效串联电阻（ESR）与等效串联电感（ESL），在射频与高速电路中表现稳定。
- 工艺兼容：适用于无铅回流焊接工艺，可靠性与批量贴装工艺成熟。
四、典型应用场景
- 射频匹配网络、射频滤波器与调谐回路；
- 振荡器与时钟电路中的负载/定容；
- 高频耦合、旁路与去耦（在需要微小电容值时）；
- 精密模拟电路中用作反馈或补偿元件。
五、封装与焊接建议
- 贴装：0402 尺寸对贴片机、回流工艺与贴装精度有较高要求，建议采用自动贴装并严格控制吸嘴与送料参数；
- 回流焊：参考村田推荐的回流曲线，避免过高峰值温度与过长的加热时间以减少热应力；
- PCB 布局：尽量使电容靠近被去耦或匹配的器件引脚，优化走线以降低寄生电感；为小尺寸电容留足焊盘与阻焊间距，按厂商推荐的 land pattern 布置以提高可靠性。
六、使用与检验要点
- 电压应用：尽管额定 50 V，但在实际使用中应关注电场对介质的影响（电容量随偏压可能变化），高精度场合需做电容-电压特性验证；
- 机械应力：0402 封装对焊接与振动敏感，应避免在装配或测试过程中施加过大机械力；
- 质量检验：批量入库建议抽检外观、尺寸、电容值与介损（DF）等指标；必要时采用 X 光检测内裂或缺陷。
总结：GRM1555C1H2R2BA01D 以其微小体积与良好高频特性，适合对空间与寄生参数敏感的设计。为确保电路性能，设计与生产过程中请参照村田官方数据手册与推荐焊接/布线规范进行验证与优化。
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