Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM21BR61H106KE43L是一款由著名电子元器件制造商muRata(村田)生产的多层陶瓷电容器(MLCC)。该电容器的基本参数包括额定电容值为10µF、容差为±10%、额定电压为50V,具有极好的温度特性,温度系数为X5R,适合于要求严格的电子应用。这种电容器的工作温度范围广泛,从-55°C到+85°C,可以在多种环境条件下稳定工作。
GRM21BR61H106KE43L采用0805(2012公制)封装,其尺寸为2.00mm x 1.25mm,最大厚度为1.45mm。这种紧凑的表面贴装设计使其适合于现代紧凑型电子设备,能够有效节省电路板空间,同时也便于自动化贴装。这对于移动设备、消费电子产品及各种便携式设备的设计尤其重要。
GRM21BR61H106KE43L广泛应用于各种电子产品中,包括但不限于:
该电容器的技术优势在于其优异的温度性能、长寿命和低损耗特性。X5R材料在不同温度和电压条件下保持良好的电气性能,使得该电容器在高频应用中表现出色。同时,muRata的高品质制造工艺确保了电容器的高可靠性和环境适应性。
GRM21BR61H106KE43L电容器符合RoHS标准,确保其在环保和安全方面的合规性。此外,产品在高温、湿度、以及周期性的电压应力测试中的表现,表明其在极端条件下仍可保持正常工作,而不会导致性能的显著下降。
综上所述,GRM21BR61H106KE43L是一款高性能、多用途的MLCC电容器,具有优良的电气性能和可靠性,适合于广泛的电子应用。无论是在消费电子、工业控制还是通信设备中,其稳定性和紧凑尺寸都使其成为设计师优先选择的元器件之一。由于其广泛的适用性和卓越的性能,该产品无疑将在现代电子设计中发挥重要作用。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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