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muRata DLW21HN900HQ2L
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata DLW21HN900HQ2L
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- DLW21HN900HQ2L
- Electronic Component
- 1
- Package
- SMD-4P,2x1.2mm
- Electronic Component
- Common Mode Filter
- Electronic Component
- 0.024g
- Voltage
- 50V
- Electronic Component
- 1
- Channel Count
- 2
- Electronic Component
- BM0227258250
- Operating Temperature
- 40℃~+85℃
- Resistor
- 10MΩ
- Voltage
- 20V
- Current
- 220mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DLW21HN900HQ2L 产品概述
一、产品简介
DLW21HN900HQ2L 为 muRata（村田）出品的共模滤波器（共模电感/共模扼流器），适用于抑制差分信号线周边的共模电磁干扰（EMI）。器件为 SMD-4P 封装，外形尺寸 2.0 × 1.2 mm，针对空间受限的移动终端、消费电子与高速信号接口的 EMI 抑制提供紧凑解决方案。
二、主要电气参数
- 通道数：2（双通道/差分对）
- 额定电流：220 mA（最大连续通过直流电流能力）
- 阻抗：90 Ω @ 100 MHz（共模阻抗标称值，用于评估在该频点的抑制能力）
- 额定电压：20 V（工作电压）
- 耐电压（耐压）：50 V（绝缘/耐压能力）
- 直流电阻（DCR）：590 mΩ（每通道/串联电阻负载造成的压降）
- 工作温度范围：-40 ℃ ～ +85 ℃
- 绝缘电阻：10 MΩ（常温下器件对地绝缘性能）
三、性能特点与影响要点
- 小型封装（2×1.2 mm）适合高密度 PCB 布局，但需注意焊盘与回流工艺以保证焊接可靠性。
- 90 Ω @100 MHz 的共模阻抗表明在中高频段对共模噪声具较好抑制，适合对 100 MHz 附近干扰敏感的应用场景。
- 220 mA 的额定电流与 590 mΩ 的 DCR 指示该器件更适合信号线而非大电流电源线，使用时需考量压降与功耗。
- 20 V 工作电压与 50 V 耐压提供基本的电压边界保护，设计时应保证线路电压和瞬态不超过该范围。
四、典型应用场景
- 移动设备和便携式电子产品的高速差分信号线（如某些低电流 USB、串行高速信号）EMI 抑制。
- 汽车电子非高功率信号链路的干扰滤除（在工作温度与电压范围内）。
- 任何空间受限环境下需兼顾滤波性能与尺寸的小信号接口。
五、选型与布局建议
- 若信号线工作电流接近或超过 220 mA，应选择更高额定电流器件以避免过热或饱和。
- 对于注重差模信号完整性的系统，注意该器件为共模滤波器，对差模插入损耗较小，但仍应评估带宽与群延时影响。
- 布局上建议将器件靠近干扰源（如接口处）放置，并保证地平面完整以提高共模抑制效果；避免在器件下方布置敏感模拟回路。
- 考虑 DCR 带来的压降与功耗，必要时在 PCB 布线和散热设计上预留裕度。
六、可靠性与注意事项
- 工作温度 -40 ℃ 至 +85 ℃，超出范围可能影响性能与寿命。
- 焊接及回流工艺需参照厂商封装说明以防内部损伤；存储与清洗时注意不要使用会侵蚀绝缘层的化学品。
- 绝缘电阻 10 MΩ 在高湿或污染环境下可能下降，关键应用应考虑绝缘与防护措施。
如需对接电路示意、替代型号对比或 PCB 封装建议图（Footprint），可提供具体应用场景与电气条件以便给出更精细的设计建议。
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