Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GJM1555C1HR80BB01D 是一款由知名品牌 muRata(村田)制造的高性能贴片电容器,属于多层陶瓷电容器(MLCC)系列。该电容器广泛应用于 RF(射频)、微波以及高频电路中,尤其适用于要求高 Q 值及低损耗特性的场合,具有出色的电性能和稳定性。
GJM1555C1HR80BB01D 电容器以其高 Q 值和低损耗特性脱颖而出,使其在高频应用中具备优越的性能表现。高 Q 值意味着该器件在频率较高的情况下,能够有效减少能量损耗,是那些对信号完整性要求极高的 RF 和微波设计中不可或缺的选择。
此外,该电容器的电容值为 0.8 pF,具有非常紧凑的容差范围,±0.1 pF,这对于高频电路中频率选择和信号调谐尤为重要。适当的电容值和精确的容差为电路设计提供了更高的灵活性与可靠性。
GJM1555C1HR80BB01D 电容器因其优越的电气性能,广泛应用于多个高端领域:
GJM1555C1HR80BB01D 电容器采用表面贴装技术,便于在现代电子产品中实现高密度安装。这种封装形式使得焊接和二次加工更加简便,加快了产品的生产效率。同时,0402 封装尺寸使其能够适用于小型、便携式或空间受限的电子设备。
总体而言,GJM1555C1HR80BB01D 是一款性能卓越、适用范围广泛的多层陶瓷电容器。其高 Q 值、低损耗、优越的电压额定值及宽工作温度范围,使其成为高频电路设计中的理想选择。在电容器日益小型化且性能要求日益提升的现在,GJM1555C1HR80BB01D 电容器将在 RF、微波以及各种高频应用中继续展现其可靠性与优秀的电气特性,满足不同版本电气系统的严苛需求。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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