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muRata GJM1555C1HR80WB01D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GJM1555C1HR80WB01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GJM1555C1HR80WB01D
- Electronic Component
- 1
- Electronic Component
- 0.8pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0229472534
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GJM1555C1HR80WB01D 产品概述
一、产品简介
GJM1555C1HR80WB01D 是村田（muRata）生产的一款贴片多层陶瓷电容（MLCC），主要参数为：容值 0.8 pF、额定电压 50 V、温度系数 C0G（又称 NP0）、封装 0402（1005 公制，约 1.0 × 0.5 mm）。该型号面向对温度稳定性和线性度要求较高的高频与精密电路应用。
二、主要特性
- 极低的温度系数（C0G）——近乎零漂移，典型温度系数在 ±30 ppm/°C 量级，保证在宽温度范围内电容稳定。
- 优良的线性与低电压系数：在工作电压下容值变化极小，适合高精度频率控制与谐振场合。
- 适合高频应用：损耗低、Q 值高，自身等效串联电感（ESL）和等效串联电阻（ESR）较低，有利于 GHz 级信号处理。
- 小尺寸（0402），便于高密度 SMT 贴装。
三、典型应用场景
- 高频匹配网络、射频滤波、谐振回路与振荡器负载元件。
- 天线微调、电路微带线调谐与阻抗匹配。
- 高频耦合与去耦（小容值配合更大容值使用）。
- 精密计时、A/D、VCO 与相位噪声敏感电路中的旁路/补偿元件。
四、PCB 布局与焊接建议
- 采用厂商推荐的焊盘尺寸与过孔布局，控制焊膏量以避免焊接应力。
- 使用贴片自动贴装与无铅回流焊工艺，遵循村田提供的回流曲线（无铅回流峰值温度通常参照 J-STD-020），避免超温重流。
- 对于射频用途，尽量缩短走线与减少回路面积，以降低寄生电感和杂散电容。
- 布局时注意与机械应力源（板边、螺丝孔）保持距离，减小因板弯曲引起的压应力。
五、可靠性与测试要点
- 虽为陶瓷电容，仍需注意机械冲击与弯曲导致的开裂问题；在高机械应力环境选择合适封装或加固。
- 小容值测量时须考虑测试夹具与探针的寄生电容与连接线影响，建议使用高频 LCR 或网络分析仪并采用空载校准。
- 若用于射频系统，可向厂方索取 S 参数或在设计阶段做实际板级仿真与测量验证。
六、选型提示与资料
- 在选型时确认容差、频率响应及是否需要低损耗等级的特殊款项；如需更详细的电气参数、封装尺寸及回流规范，请参考村田官方数据手册或联系技术支持获取样品和测试数据。
上述为 GJM1555C1HR80WB01D 的主要特性与工程应用注意事项，适合对温度稳定性和高频特性有较高要求的电子设计场景。
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