Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品型号: GRM155R60J105KE19D
制造商: muRata (村田)
封装类型: 0402(1005公制)
电容值: 1µF
容差: ±10%
额定电压: 6.3V
温度系数: X5R
工作温度范围: -55°C to 85°C
安装类型: 表面贴装 (MLCC)
尺寸: 1.00mm x 0.50mm (长 x 宽)
最大厚度: 0.55mm
GRM155R60J105KE19D是一种贴片陶瓷电容器,具备高性能和优良的稳定性,特别适用于高密度电路板。其采用的X5R温度系数材料使其在宽温度范围(-55°C至85°C)内仍能维持良好的电容稳定性,这对于需要在不同环境下工作的电子设备来说,即使在极端温度下也能保持其电气性能。
表面贴装设计: 0402封装尺寸使该电容器适合现代小型化设计,特别是在便携式电子产品、移动设备及其他高密度设备中,能够有效节省PCB空间,同时简化安装过程。
电容量与电压特性: 1µF的电容可以满足多种应用需求,适合用于滤波、耦合和去耦等电路场合。额定电压6.3V使其可以在多种工作条件下安全使用,使其在汽车电子、通信和工业控制等领域展现出广泛的适用性。
耐高温性: 该电容具有很好的热稳定性,无论是在高温或低温环境下,其性能几乎不受影响,因此适用于极端环境下的电子产品。
可靠性与一致性: 村田作为全球领先的电子元器件制造商,GRM155R60J105KE19D的可靠性和一致性得到了广泛认可,其产品广泛应用于高要求行业,包括医疗、军事和航空航天等。
GRM155R60J105KE19D的应用场景十分广泛,主要涵盖以下领域:
消费电子: 由于其小型化特性和适中的电容量,该电容器常用于手机、平板电脑、智能手表等消费电子产品中,以确保信号的稳定和电源的去耦。
汽车电子: 在汽车电子控制单元中,稳定性和可靠性至关重要。GRM155R60J105KE19D电容器可以有效用于车载信息娱乐系统、自动驾驶传感器和电动助力转向系统中。
通信设备: 在射频电路和基站设备中,GRM155R60J105KE19D可以用于滤波器和耦合电路,以降低噪声和提高信号质量。
工业控制: 在各类工业自动化设备和控制系统中,此电容器可以作为去耦电容,提供电源稳压,确保系统的正常运行。
GRM155R60J105KE19D电容器是一款性能卓越、兼具高稳定性和可靠性的贴片电容器,特别适合在移动设备、汽车电子和通信领域等高-density和要求严格的应用场合中使用。其小巧的0402封装、宽广的温度范围以及适中的容量值,为设计师在进行产品开发时提供了灵活的选择。
无论是在确保信号完整性、降低电源噪声,还是在复杂环境中保持可靠性能,GRM155R60J105KE19D都有着出色的表现,是现代电子设计不可或缺的优秀元器件之一。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products