Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM033R60J474KE90D 是一款由知名电子元器件制造商村田(muRata)生产的表面贴装多层陶瓷电容(MLCC)。该元器件具有额定电压为6.3V,电容值为0.47µF,容差为±10%。其封装尺寸为0201(0.024" x 0.012" 或 0.60mm x 0.30mm),厚度最大为0.013"(0.33mm)。该电容工作温度范围为-55°C至85°C,材料特性符合X5R温度系数,适用于多种应用场合。
小型化: GRM033R60J474KE90D 采用0201封装,极小的尺寸使其在设计空间有限的应用场景中表现突出。适合高密度电路板设计,降低了整体空间占用,并且有助于提高设备的便携性。
良好的温度稳定性: X5R温度系数表明该电容在较宽的温度范围内保持良好的电容值稳定性,适合在温度变化较大的环境中使用。
高可靠性: 作为村田的产品,GRM033R60J474KE90D具备优良的材料特性,具有低的漏电流和长寿命,能够满足不同工业应用中的可靠性需求。
轻量化: 该电容典型的轻质特性,使其非常适合航空航天和移动设备等轻量化设计的应用,降低了设备整体重量。
高频性能: 适合高频电路,能够在高频信号下稳定工作,广泛应用于射频(RF)和微波领域。
GRM033R60J474KE90D可广泛应用于以下几种场景:
消费电子: 由于其小型、低功耗和高性能,该电容在智能手机、平板电脑、可穿戴设备等消费电子产品中极其常见,为信号耦合、滤波等功能提供支持。
工业设备: 在各种工业控制设备中,GRM033R60J474KE90D可用于电源耦合和信号滤波,确保设备的稳定性和可靠性。
汽车电子: 随着汽车电子设备的快速发展,该电容在汽车控制系统中的使用日益增加。在电源管理、传感器及通信模块中都能发挥关键作用。
医疗设备: 医疗设备对元器件的可靠性有着极高的要求,GRM033R60J474KE90D以其稳定的性能成为监测设备、影像设备和医疗记录仪等仪器中的理想选择。
电力系统和通讯设备: 在UPS、逆变器及其他电源设备中,也常使用此类电容以提升系统的效率和稳定性。
总的来说,GRM033R60J474KE90D是一款具有高性能、小型化、可靠性强的多层陶瓷电容,适应多种应用场合,尤其是在对空间及性能要求较高的电子设备中。无论是在消费电子、工业控制还是汽车电子领域,其出色的特性,使其成为工程师们在设计和选型时的优先选择。同时,村田(muRata)作为知名品牌,确保了产品的一致性和可靠性,进一步增强了用户的信心。在未来的技术发展中,GRM033R60J474KE90D将继续发挥其卓越的性能和应用广度。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products