Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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GCM155R71H103KA55D是一款由村田(muRata)公司制造的高性能贴片陶瓷电容器,主要用于汽车等级应用。该产品采用0402封装(1005公制),具有较小的体积,适用于空间有限且对电气性能有较高要求的电子电路。电容器的容值为10nF,额定电压为50V,能够有效满足现代汽车电子、工业设备及消费电子产品中的多种应用需求。
基本参数
工作环境
物理特性
质量标准
高可靠性:凭借AEC-Q200认证,GCM155R71H103KA55D电容器能够在极端环境条件下稳定运行,符合汽车电子的安全性和可靠性标准。
优异的温度特性:采用X7R材料的电容具有良好的温度稳定性,能够在广泛的温度范围内提供可靠的容量变化特性,适合温度变化较大的应用场景。
小型化设计:0402封装使该产品具备超小的尺寸,能够轻松地嵌入到紧凑型电路板设计中,这对于智能电子设备至关重要。
** 良好的电气性能**:±10%的容差结合50V的额定电压提供了出色的电气性能,确保在实际应用中的稳定工作。
GCM155R71H103KA55D电容器广泛应用于以下领域:
汽车电子:由于其高可靠性和抗高温性能,此款电容器特别适合用于汽车引擎、车载电子控制单元(ECU)、传感器和各种连接器中。
工业设备:在工业自动化和控制系统中,电容器的耐用性和稳定性使其成为理想选择。
消费电子:适合用于手机、平板电脑、可穿戴设备等各种小型电子产品,满足快速发展的消费电子市场对于小型化、低功耗和高效能的需求。
通信设备:在信号处理和射频电路中,GCM155R71H103KA55D可用于滤波和耦合应用,确保信号的完整性与稳定性。
GCM155R71H103KA55D是一款集成了优异性能的小型陶瓷电容器,专为苛刻环境下的汽车及工业应用而设计。其出色的温度稳定性、可靠的电气特性以及标准化封装使其成为现代电子产品设计中不可或缺的基础组件。无论是在高端汽车、工业控制、还是消费类电子产品中,这款电容器都能为设计工程师提供强有力的支持与保障。选择村田的GCM155R71H103KA55D电容器,将为您带来更高的产品质量与持续的市场竞争力。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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