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muRata BLM03HD331SN1D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- mu Rata BLM03HD331SN1D
- Type
- MURATA
- Minimum package
- 15000
Technical parameters
- Electronic Component
- MURATA
- Electronic Component
- BLM03HD331SN1D
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0257273198
- Operating Temperature
- 55℃~+125℃
- Current
- 200mA
- @Frequency
- 330Ω@100MHz
- Resistor(DCR)
- 1Ω
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BLM03HD331SN1D 产品概述
一、产品简介
BLM03HD331SN1D 是村田（muRata）系列微型磁珠，用于高频干扰抑制与电磁兼容（EMC）设计。该器件封装为 0201（极小尺寸），单通道设计，标称阻抗为 330Ω @ 100MHz，允许误差 ±25%。适合对体积和布局有严格要求的移动设备、蓝牙/Wi‑Fi 模块、射频前端及供电滤波场合。
二、主要电气与环境参数
- 阻抗（Z）：330Ω @ 100MHz（典型值，±25%）
- 直流电阻（DCR）：1Ω
- 额定电流：200 mA（连续）
- 通道数：1
- 工作温度范围：-55℃ ~ +125℃
- 封装规格：0201（极小封装）
- 品牌：muRata（村田）
这些参数说明该磁珠在 100MHz 附近对高频噪声有显著衰减能力，但小封装与相对较高的 DCR 限制了其在大电流电源路径的应用。
三、性能分析与工程影响
- 阻抗特性：330Ω @100MHz 表明在无线通信和开关电源产生的高频干扰带宽内有良好抑制效果。实际应用中应参考厂家的频率响应曲线（阻抗随频率变化）以确定最优工作频段。
- 直流电阻与功耗：DCR 为 1Ω，连续通过 200 mA 时产生的功耗约为 P = I^2·R = 0.2^2 × 1 = 0.04 W。虽然数值不大，但在密集布局或长期高温环境下仍需考虑温升与热累积。
- 额定电流限制：200 mA 的额定电流来自热与电气可靠性考虑，超过该值会降低阻抗并加速老化，必要时应选用更大尺寸或低 DCR 的器件。
四、典型应用场景
- 移动终端与可穿戴设备的射频滤波
- 模块化无线通信（Wi‑Fi、蓝牙、IoT 节点）的输入/输出端干扰抑制
- 模拟与数字电路之间的 EMI 隔离
- 低电压电源线的高频噪声滤除（注意 DCR 和电流限制）
五、布局与使用建议
- 靠近噪声源或受干扰输入端放置，以获得最佳抑制效果（例如靠近晶振、天线馈线或开关元件）。
- 由于为单端磁珠，串联插入信号或电源线上即可；在电源回路使用时评估直流压降与功耗。
- 0201 封装体积极小，焊接与回流工艺应严格控制；尽量采用 PCB 布局与焊膏量符合村田推荐的 PCB land pattern。
- 在高温或高电流应用中应进行热仿真验证和实际测温测试，必要时加大散热或选用更大封装产品。
六、选择与替代建议
若需要更低的直流电阻或更高额定电流，可考虑更大封装（0402、0603）或采用低 DCR EMI 滤波器。同样若目标频段低于 100MHz，应核对器件在该频段的阻抗曲线，或选用适配频率的磁珠型号。
总结：BLM03HD331SN1D 以其小型 0201 封装和在 100MHz 附近的高阻抗，适合对空间要求严格且需抑制高频干扰的便携与射频设备。在设计时需权衡其 1Ω 的 DCR 与 200 mA 的电流能力，并按厂商建议的封装焊接和布局规范实施。
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