WMSIC Electronic Components

muRata GRM0335C1HR90BA01D

ModelGRM0335C1HR90BA01D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
mu Rata GRM0335C1HR90BA01D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM0335C1HR90BA01D
Electronic Component
1
Electronic Component
0.9pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0257359347
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM0335C1HR90BA01D 产品概述

一、产品基本参数

  • 类型:陶瓷多层贴片电容(MLCC)
  • 品牌:muRata(村田)
  • 型号:GRM0335C1HR90BA01D
  • 容值:0.9 pF
  • 公差:±0.1 pF(绝对值)
  • 额定电压:50 V DC
  • 温度特性:C0G(NP0),近乎零温度系数
  • 封装:0201(约 0.6 mm × 0.3 mm)
  • 安装方式:SMD,带盘装(Tape & Reel)

二、主要特性

  • 极佳的温度稳定性与频率稳定性:C0G/NP0 陶瓷介质在宽温区间内容值基本不变,适合高精度电路。
  • 低损耗、低介质吸收:适合射频及高速信号链路中对相位和增益要求严格的场合。
  • 体积小、寄生量低:0201 尺寸降低串联电感和走线长度,有利于高频性能。
  • 公差窄(±0.1 pF):适用精密匹配、滤波与时基电路。

三、典型应用

  • 高频匹配网络与阻抗调整(RF 前端、滤波器、天线调谐)
  • 高频耦合/旁路与采样电路(ADC 前端、低噪放大器)
  • 高频振荡器与定时电路(LC 谐振回路的精确电容)
  • 精密仪表与测量设备中要求温漂和稳定性的元件

四、设计与使用建议

  • 布局:尽量将电容放置在信号或电源点邻近位置,走线短且粗,减小串联电感与寄生电阻。关键射频点建议接地面连续、避免穿孔造成寄生。
  • 焊接:符合无铅回流工艺,具体回流曲线与可允许温度请参考村田官方焊接指南以防裂纹或性能下降。
  • 焊膏与印刷:0201 对焊膏量与焊盘尺寸敏感,须做工艺验证以避免 tombstoning 或焊接缺陷。
  • 机加工与装配:避免在贴片后板材弯曲或机械冲击,微型封装对压力与冲击敏感,推荐在组装工艺中控制挤压应力。
  • 电压降额与偏压:C0G 本身 DC 偏压影响极小,但 0.9 pF 量级在电路中会受寄生与测试条件影响,建议在目标频率与工作电压下进行实测确认。

五、可靠性与品质保证

  • 村田为全球知名被动元件制造商,产品通过常规电气与环境测试(如温度循环、湿热、机械冲击等)。
  • 常见失效模式为机械损伤(裂纹、断裂)与不良焊接(虚焊、桥联),建议在 PCB 设计和装配流程中加强控制。
  • 环保合规:符合 RoHS 等环保要求(具体合规证明请参阅厂家文件)。

六、采购与替代建议

  • 订购时请使用完整型号 GRM0335C1HR90BA01D,并确认包装形式(卷带/盘装)与最小包装量。
  • 若需不同公差或电压等级,可咨询村田同系列 C0G 0201 尺寸的其他型号;在无特殊频率要求下也可考虑等效 NP0 产品替代,但关键射频或精密应用应先做电性验证。

总结:GRM0335C1HR90BA01D 以其 0.9 pF、C0G 温漂、0201 小封装与窄公差的组合,适合对稳定性、频率特性与体积有严格要求的高频与精密电子设计。选型与上板时请注意焊接工艺与机械应力控制,必要时参考厂方技术资料以确保长期可靠性。

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