Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata LQP03TGR12J02D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata LQP03TGR12J02D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- LQP03TGR12J02D
- Electronic Component
- 1
- Package
- 0201
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Inductor
- 120nH
- Electronic Component
- 1
- Factor
- 6@300MHz
- Electronic Component
- BM0058417922
- Current
- 80mA
- Frequency
- 800MHz
- Resistor(DCR)
- 8.75Ω
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：LQP03TGR12J02D
LQP03TGR12J02D是一款高性能的表面贴装电感，专为现代电子设备的高频应用设计。该电感元件由著名品牌muRata（村田）制造，采用厚膜技术，确保其在电子性能和可靠性方面达到高标准。产品规格表明，该电感具有基本的电感值为120 nH，具有±5%的容差和80 mA的额定电流，使其在广泛的应用场景中表现优越。
1. 基本参数
- 电感值: 120 nH
- 容差: ±5%
- 额定电流: 80 mA
- DC 电阻: 最大8.75 Ω
- Q值: 6 @ 300 MHz
- 自谐振频率: 800 MHz
上述参数表明，LQP03TGR12J02D的电感性能非常适合高频应用。在300 MHz的条件下，该电感所显示的Q值为6，指示了其在特定频率下的良好信号保留特性。这种特性使其非常适合用于射频（RF）电路和其他高频信号应用。
2. 工作环境与可靠性
LQP03TGR12J02D电感在-55°C至125°C的广泛工作温度范围内运行，增强了其在苛刻环境条件下的稳定性和可靠性。无磁性材料的使用提高了电感在容易受到磁干扰的环境中的表现，确保信号的准确传输。
3. 封装与安装
电感器的封装类型为0201（0603公制），尺寸为0.024" x 0.012"（0.60mm x 0.30mm），高度为0.013"（0.33mm）。这种小巧的尺寸使得LQP03TGR12J02D电感非常适合空间受限的应用，如智能手机、平板电脑、戴式设备等。作为一种表面贴装型元件，该电感能方便地与自动化设备配合使用，提高生产效率。
4. 应用领域
LQP03TGR12J02D电感广泛应用于多种高频电路设计，包括但不限于射频放大器、滤波器和调制解调器等。在无线通信、移动通信和物联网设备的设计中，电感的选择至关重要，因其能显著影响信号完整性和电路稳定性.
5. 整体优势
作为muRata（村田）生产的元件，LQP03TGR12J02D电感享有品牌的可靠性和市场的良好声誉。其优异的频率特性、耐高温能力以及小型化设计使得它在快速发展的电子应用领域中，占据了举足轻重的地位。特别是在复杂的高频系统设计中，使用这款高性能的电感元件，可确保电路设计的达到预期功能及性能指标。
6. 总结
LQP03TGR12J02D电感是一款结合了高性能指标和广泛应用领域的小型表面贴装电感。大到信号完整性，小到产品的可封装性，muRata的这款电感无疑是在现代电子产品设计中不可或缺的组件。针对追求高效率、快速响应和小型化产品设计的应用，这款电感展示了其不可估量的价值，并为工程师们提供了一种可靠的解决方案。无论是在设计新一代无线通信系统，还是进行高频电路的优化，这款电感都是理想的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
