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muRata GRM0335C1H3R2BA01D
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- mu Rata GRM0335C1H3R2BA01D
- Type
- MURATA
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1H3R2BA01D
- Electronic Component
- 1
- Electronic Component
- 3.2pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0264596012
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM0335C1H3R2BA01D 产品概述
一、概述
GRM0335C1H3R2BA01D 为 muRata（村田）生产的贴片多层陶瓷电容（MLCC），封装尺寸为 0201，标称容量 3.2 pF，额定电压 50 V，温度系数为 C0G（又称 NP0）。该器件以体积极小、温度稳定性高和电气特性优良著称，适合对频率响应和电容稳定性要求较高的应用场合。
二、主要特性
- 容值小且精确，适合高频和谐振电路使用。
- C0G 温度系数近似零，具有极低的温漂和无明显老化特性，保证在宽温度范围内稳定工作。
- 低损耗、低等效串联电阻（ESR）与低等效串联电感（ESL），有利于高频性能与相位稳定性。
- 0201 超小封装，便于高密度贴装与空间受限设计。
三、典型应用场景
- 射频（RF）匹配网络、滤波器与谐振回路；
- 时钟、振荡器与频率合成电路中作为定值电容；
- 精密模拟前端、电压参考与比较器的旁路/耦合电容；
- 移动设备、无线模块、射频前端与高密度 PCB 设计。
四、设计与布局要点
- 由于容值较小，电路中 PCB 板的寄生电容与走线电感对性能影响显著，布线时应尽量缩短引线长度并靠近相关器件放置；
- 对于射频应用，优先使用地平面和合理的过孔布局以降低回流电感；
- C0G 系列对直流偏压依赖性小，但在高频环境仍需考虑自谐频率（SRF），必要时进行实际 S 参数或网络分析测量。
五、焊接与可靠性建议
- 遵循厂商推荐的回流焊温度曲线进行组装，避免过度热应力与冷热冲击；
- 贴装与检验过程中注意静电防护与避免机械冲击；
- 储存时保持干燥环境，长期储存后建议按标准回流前进行烘烤处理（参考制造商资料）。
六、选型参考与替代方案
- 若需更大容值但允许温漂，可考虑 X7R/X5R 等高介电常数材料；
- 若需要更高耐压，请选择更高额定电压的封装或型号；
- 在射频设计中，如对 ESR/ESL 有更严格要求，可参照制造商提供的等效电路参数或直接索取测量数据进行仿真验证。
如需该型号的详细电气参数、等效模型或最新数据手册，可联系供应商或访问 muRata 官方网站获取完整资料，以便在具体电路中进行精确仿真与验证。
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