Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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基本信息
GRM21BZ71E106KE15L 是由Murata Electronics制造的一款表面贴装多层陶瓷电容器(MLCC)。此款电容器以其优良的电气性能和适应性广泛应用于各种电子设备中,尤其在高密度电路板设计中表现卓越。该电容器的规格和特性使其非常适合用于需要稳定和可靠电性能的应用,如消费类电子、工业设备和汽车电子。
设计与封装
GRM21BZ71E106KE15L采用0805封装规格(2025公制),其尺寸为2.00mm x 1.25mm,最大厚度为1.45mm,能够方便地集成到现代紧凑型电路中。由于其小巧的体积,这款电容器能够在有限的空间内提供高电容值,适合需要高效能和高集成度的电路设计。
电气特性
该电容器电容值为10µF,具有±10%的容差,这确保了在使用过程中电容值的稳定性和可靠性。其额定电压为25V,使其适用于多个电压应用场景。特别的是,GRM21BZ71E106KE15L采用X7R温度系数,这种材料具备在-55°C ~ 125°C的温度范围内提供相对稳定的电容特性,因此在多变的环境中也能保持良好的电气性能。
应用场景
GRM21BZ71E106KE15L适用于多种应用场景,包括但不限于:
性能优势
使用多层陶瓷电容器的优势包括:
总结
GRM21BZ71E106KE15L是一款理想的多层陶瓷电容器,适合各类要求高电压、高容量及高稳定性的应用。凭借其出色的技术规格和性能优势,Murata Electronics的这一产品无疑是现代电子设计的优秀选择。不论是用于日常消费电子产品,还是在工业和汽车应用中,GRM21BZ71E106KE15L都能充分满足设计师对效率和可靠性的追求。在未来的电子产品开发中,选择这样一款高品质的电容器,将为产品的性能提升带来显著的价值。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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