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muRata GRM155Z71A225KE44D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM155Z71A225KE44D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM155Z71A225KE44D
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0252997539
- Electronic Component
- X7R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM155Z71A225KE44D 产品概述
一、产品简介
GRM155Z71A225KE44D 为村田（muRata）生产的贴片多层陶瓷电容（MLCC），标称容量为 2.2 µF，初始容差 ±10%，额定电压 10 V，介质为 X7R，封装为 0402（≈1.0 × 0.5 mm）。该型号在体积极小的同时提供较大的电容量，适合空间受限且需要中等容量去耦或旁路的应用。
二、主要电气参数
- 容量：2.2 µF
- 初始容差：±10%
- 额定电压：10 V DC
- 介质：X7R（-55°C 至 +125°C 温度特性）
- 封装：0402（超小型贴片）
- 特性：低等效串联电阻（ESR）与低等效串联电感（ESL），适合高频去耦
三、特点与性能
- 小尺寸高容量：0402 尺寸在高密度 PCB 设计中节省空间，2.2 µF 在同尺寸中属于较大容量等级。
- 宽温度工作范围：X7R 介质在-55°C 至 +125°C 范围内保持稳定性，适合一般工业与消费电子环境。
- 高频性能良好：低 ESR/ESL 有利于电源去耦、抑制瞬态噪声与降低电磁干扰。
- 表面贴装、回流焊兼容，符合现代 SMT 工艺需求。
四、使用注意与设计建议
- 直流偏置效应：X7R 类高介电常数陶瓷电容随外加 DC 电压会出现有效容量下降现象，实际工作容量可能显著低于标称值，设计时须参考厂商提供的“容量-偏置”曲线并留有裕量。
- 温度与老化：尽管 X7R 温度稳定性优于 X5R，仍存在温度依赖与随时间缓慢老化的特性，关键电路建议采用冗余或并联不同容量/型号以保证可靠性。
- 布局建议：用于芯片或稳压器的去耦时，应尽量靠近供电引脚布置，缩短走线，减小回路面积；必要时与小容量低电感电容并联以扩展高频响应。
- 焊接工艺：遵循村田推荐的回流曲线与焊盘设计，避免过度机械应力与热应力导致可靠性问题。
五、典型应用
- MCU、FPGA、ASIC 等数字芯片电源去耦
- 移动设备、可穿戴与物联网终端的电源滤波
- 电源模块输入/输出旁路与去耦
- 汽车电子（非关键安全回路）、工业控制及消费类电子产品
六、结论
GRM155Z71A225KE44D 在超小封装下提供较大容量和良好的高频去耦性能，适合空间受限且对去耦有较高要求的电子设计。使用时应重点关注直流偏置与温度影响，参考村田数据表的容量-偏置、温度特性及可靠性信息，按需在电路中留有裕量或采用并联方案以确保长期稳定工作。
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