WMSIC Electronic Components

muRata BLM31SN500SN1L

ModelBLM31SN500SN1L
Package1206
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
mu Rata BLM31SN500SN1L
Type
MURATA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
BLM31SN500SN1L
Electronic Component
1
Package
1206
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.042g
Electronic Component
1
Channel Count
1
Electronic Component
BM0229935177
Operating Temperature
55℃~+125℃
Current
12A
@Frequency
50Ω@100MHz
Resistor(DCR)
1.6mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BLM31SN500SN1L 产品概述

一、产品简介

BLM31SN500SN1L 是村田(muRata)推出的一款高电流磁珠 EMI 抑制元件,封装尺寸为 1206(实质上为 3.2×1.6mm 级别),单通道设计,适用于电源与高电流信号线的射频噪声抑制。标称阻抗 50Ω(@100MHz,±25%),直流电阻仅 1.6mΩ,额定电流 12A,工作温度范围 -55℃ 至 +125℃。

二、主要性能与规格

  • 阻抗:50Ω @ 100MHz,允许误差 ±25%(设计时应留有裕量)
  • 直流电阻(DCR):约 1.6mΩ,导通损耗小
  • 额定电流:12A(连续电流能力,建议参考厂方曲线作热/电流校核)
  • 通道数:1(单端磁珠)
  • 工作温度:-55℃ ~ +125℃
  • 封装:1206,便于自动贴装与回流焊接

三、典型应用场景

  • 手机、平板、笔记本等移动设备的电源线 EMI 抑制
  • 电源管理模块(PMIC)输出、CPU/GPU 电源总线
  • 高电流开关电源输出滤波与噪声隔离
  • 汽车电子与工业级电源系统中对高速干扰的吸收

四、布局与安装建议

  • 将磁珠尽量靠近噪声源(例如电源开关元件或IC)放置,以缩短寄生走线长度。
  • 与去耦电容配合使用:磁珠靠近噪声源,去耦电容靠近负载/地,形成低阻抗滤波回路。
  • 尽量减少通过磁珠处的引脚、焊盘阻抗与热阻;保证焊盘宽且铜厚以利于散热和电流承载。
  • 如需更高抑制量,可考虑串联多颗或与差模/共模滤波器组合,但注意总DCR和电压降。

五、热与电气注意事项

  • 按 I^2·R 估算最大损耗:在 12A 时损耗约 0.23W(144×0.0016),长期工作会产生自热,建议在高连续电流工况下进行温升评估与热管理。
  • 磁珠的阻抗随频率与直流偏置电流会发生变化,高直流电流时阻抗可能下降,需以厂商阻抗-电流曲线为准。
  • 选择时考虑阻抗容差 ±25%,关键频段应留有裕度,避免因工况变化导致滤波失效。

六、可靠性与制造工艺

  • 适用于标准无铅回流焊工艺,具体回流曲线与焊接参数请参照村田官方资料。
  • 工作温度范围宽,适配汽车和工业环境。但在极端温度或振动环境下应做可靠性验证。
  • 储存与贴片前处理按常规无铅元件要求执行,避免潮湿引起焊接缺陷。

总结:BLM31SN500SN1L 以其低 DCR、高电流承载与 100MHz 附近良好阻抗,适合对电源线与高电流线路进行有效的 EMI 抑制。实际设计中应结合 PCB 布局、热管理与厂方阻抗/电流曲线进行选型与验证,以获得稳定可靠的抑干扰效果。

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