WMSIC Electronic Components

muRata GRM0335C1H100GA01D

ModelGRM0335C1H100GA01D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
mu Rata GRM0335C1H100GA01D
Type
MURATA
Unit
Electronic Component
Minimum package
15000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM0335C1H100GA01D
Electronic Component
1
Electronic Component
10pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±2%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0258707173
Electronic Component
C0G
Voltage
50V
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM0335C1H100GA01D 产品概述

一、产品概况

GRM0335C1H100GA01D 是村田(muRata)系列的贴片多层陶瓷电容(MLCC),额定参数为 10 pF、±2% 公差、额定电压 50 V,使用 C0G(又称 NP0)温度特性,封装为 0201(超小型片式)。该型号面向对容量稳定性和温漂要求高的高频、时钟及精密电路场景。

二、主要电气参数

  • 容值:10 pF
  • 容差:±2%(高精度等级)
  • 额定电压:50 V DC
  • 温度系数:C0G / NP0(极低温漂,温度稳定性优良,典型为 ppm 级别)
  • 封装:0201(超小型表贴)

三、性能特点

  • 温度稳定性好:C0G 材料具有接近零的温度系数,工作温度范围内容量几乎不变,适合时钟、振荡器和参考网络。
  • 损耗低、Q 值高:适合射频前端、滤波与高频匹配场合。
  • 精度高:±2% 容差便于在精密滤波、定时和阻抗控制电路中直接使用,减少调试工作。
  • 尺寸小:0201 封装有利于高密度 PCB 布局,但对贴装和焊接工艺有更高要求。

四、典型应用

  • 高频振荡器与谐振回路(RF、VCO)
  • 时钟与定时电路(晶振旁路、相位噪声控制)
  • ADC/DAC 的采样与参考网络
  • 高频滤波与阻抗匹配
  • 空间受限的移动终端、可穿戴设备、无线通信模块等

五、封装与安装注意事项

  • 0201 为超小尺寸,必须使用精准的贴装设备(贴片机)和适配的吸嘴。
  • 焊接工艺请严格参照厂商(muRata)推荐的回流温度曲线,避免超温或长时间高温引起性能退化或微裂纹。
  • PCB 设计时应注意焊盘尺寸、走线和过孔布局,避免机械应力集中造成电容损伤。
  • 贮存时保持干燥,若打开包装后长期放置,建议按厂商指引进行烘烤脱湿处理再焊接。

六、可靠性与测试

该类 C0G MLCC 通常经过焊接热冲击、温度循环、湿热和机械应力等可靠性测试,表现出优良的长期稳定性。具体的额定寿命、耐压和环境等级请参照 muRata 官方数据手册与可靠性报告。

七、选型建议与替代

  • 若需要同等尺寸与特性,但容差或电压不同,可在 muRata 产品线中查找相邻规格。
  • 在需要更大容量或降成本时,可考虑不同封装(0402、0603)或不同介质(X7R、X5R)但要权衡温漂与精度。
  • 市场上同类高稳定性 10 pF C0G 0201 产品亦可参考 TDK、KYOCERA-AVX 等供应商作为替代,最终选型以实物测试与可靠性验证为准。

备注:本文为基于给定参数的产品概述,具体电气特性、机械尺寸与焊接参数请以 muRata 官方数据手册和样品测试结果为准。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.