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muRata LQG15HS1N2B02D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata LQG15HS1N2B02D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- LQG15HS1N2B02D
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.015g
- Inductor
- 1.2nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0252997548
- Current
- 1A
- Frequency
- 6GHz
- Resistor(DCR)
- 70mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LQG15HS1N2B02D 产品概述
一、产品简介
LQG15HS1N2B02D 是村田（muRata）出品的一款超小型贴片电感，封装为 0402（LQG15 系列），适用于高频射频电路及精密滤波场合。该器件体积小、寄生参数控制良好，便于在空间受限的移动终端、射频前端和高速数字链路中使用。
二、主要参数与电气特性
- 标称电感值：1.2 nH
- 额定直流电流（Imax）：1 A
- 直流电阻（DCR）：70 mΩ
- 品质因数（Q）：8 @ 100 MHz
- 自谐振频率（SRF）：约 6 GHz
这些参数表明该电感在数百 MHz 到数 GHz 频段仍保持电感性，适合用于射频去耦、阻抗匹配以及高频共模抑制等场景。以 1 A 工作时的直流损耗约为 I^2·R = 0.07 W，热耗需在布局中考虑。
三、典型应用场景
- 射频前端的偏置电感、馈通电感（bias choke）
- 高频滤波与匹配网络（Wi‑Fi、蓝牙、移动通信子系统）
- EMI 抑制与共模滤波（与对地元件配合）
- 高速接口的噪声抑制与去耦
四、布局与焊接建议
- 采用厂商推荐的焊盘尺寸与过孔布局，保证焊接可靠性与重复性；0402 尺寸对回流温度敏感，遵循厂商回流曲线（IPC/JEDEC 指南）。
- 布线尽量短且直接，以降低寄生电容与电感；对射频用途，元件两端应与相应传输线的阻抗控制匹配。
- 周围保持适当地面清空或参照设计，避免邻近大导体引入额外寄生改变电感特性。
五、性能注意与验证方法
- SRF 在 6 GHz 附近，超过此频点器件呈现容性，应避免在谐振附近作为纯电感使用。
- Q 值随频率变化，100 MHz 时约为 8；对高频较重要的应用应通过 VNA 测量 S 参数并做去嵌（de‑embedding）以获得实际阻抗曲线与损耗。
- 对温升与电流承受能力进行实际工况评估，必要时做热耦合或加大封装尺寸选型以降低 DCR 带来的功耗。
六、选型与替代建议
- 若需更高电流或更低 DCR，可考虑更大封装（如 0805、1206）或者同系列高电流型号。
- 对于更高 Q 值或不同 SRF 要求，可参考厂商射频电感家族的其他规格，或用专用功率电感替代。
总结：LQG15HS1N2B02D 在微小尺寸下提供 1.2 nH 的高频特性与 1 A 的电流能力，适合空间受限且要求高频性能的射频与噪声抑制应用。选用时建议结合实际频段做 S 参数验证并遵循厂商焊接与布局指南。
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