WMSIC Electronic Components

muRata GRM155R71E223KA61D

ModelGRM155R71E223KA61D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM155R71E223KA61D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM155R71E223KA61D
Electronic Component
1
Electronic Component
22nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0221030967
Electronic Component
X7R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:GRM155R71E223KA61D

一、产品基本信息

GRM155R71E223KA61D是一款由著名电子元件制造商村田(muRata)生产的多层陶瓷电容器(MLCC)。该电容器的设计专为表面贴装(SMD)应用而优化,采用0402(1005公制)封装,具有极小的尺寸和优异的性能参数,特别适合于现代高密度电路设计。

二、电气性能

  • 电容值:22nF(0.022µF),该电容值在高频和高稳定性应用中表现良好。
  • 额定电压:25V,意味着在不超过此电压的情况下,电容器可以安全地工作,适用于多种供电电源系统。
  • 容差:±10%,确保了在具体电路应用中,电容值的稳定性,有助于精确的信号处理与电源管理。

三、温度特性

  • 温度系数:X7R,表示其在-55°C到125°C的工作温度范围内能够保持电容值的稳定性。这种特性使得GRM155R71E223KA61D非常适合在环境变化较大的应用场合,能够在各种极端条件下维持其电气特性。
  • 工作温度:-55°C ~ 125°C,广泛的工作温度范围使得该电容器适用于航空航天、汽车和工业控制等高要求环境。

四、物理特性

  • 封装类型:0402,长0.039"(1.00mm)x 宽0.020"(0.50mm),厚度最大0.022"(0.55mm),这款电容器由于其小巧的尺寸,非常适合于紧凑电路设计,能够节省空间并降低整体电路板的面积。
  • 安装方式:表面贴装(SMD),适应现代高速自动化生产线的自动化贴片,降低了生产成本和复杂性。

五、应用领域

GRM155R71E223KA61D广泛应用于多个领域,尤其是在对稳定性与可靠性要求较高的场景中。主要应用包括但不限于:

  • 消费电子:在智能手机、平板电脑和其他便携式设备中,用于滤波、电源去耦合等功能。
  • 汽车电子:用于车载电源管理系统、传感器与控制模块,以确保在变化的温度与环境条件下的可靠性。
  • 工业设备:适合用于各种工业控制系统和机械设备中,以实现高效的信号传输和功率管理。
  • 通信设备:在各种通讯设备中,GRM155R71E223KA61D能够有效地抑制噪声,提高信号质量。

六、总结

GRM155R71E223KA61D是一款可靠的表面贴装多层陶瓷电容器,凭借其优异的电气性能、宽广的工作温度范围,以及适应现代电子设备高密度设计的能力,得到了广泛应用。无论是在高频信号处理、功率去耦合还是其他重要应用场景,这款电容器都展现出了超凡的性能表现。选择GRM155R71E223KA61D,能够为您的电子设计提供稳定性和高可靠性支持,是现代电子工程师的优质选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.