WMSIC Electronic Components

muRata LQP03TN12NH02D

ModelLQP03TN12NH02D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata LQP03TN12NH02D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
LQP03TN12NH02D
Electronic Component
1
Package
0201
Electronic Component
SMD Inductor
Electronic Component
±3%
Electronic Component
0.008g
Inductor
12nH
Electronic Component
1
Factor
12@500MHz
Electronic Component
BM0257279568
Current
250mA
Frequency
2.9GHz
Resistor(DCR)
700mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LQP03TN12NH02D 产品概述

一、概述

LQP03TN12NH02D 为村田(muRata)出品的超小型贴片电感,封装为0201,标称电感值为 12 nH,公差 ±3%,额定直流电流 250 mA,直流电阻(DCR)约 700 mΩ。品质因数 Q=12(测量点 500 MHz),自谐振频率(SRF)约 2.9 GHz,适用于高频及射频线路中的去耦、滤波与阻抗匹配等场合。

二、主要性能特点

  • 电感值稳定:12 nH ±3% 满足高精度频率设计要求。
  • 高频性能良好:Q=12@500MHz,SRF 达 2.9 GHz,适配 GHz 级信号处理。
  • 小尺寸:0201 超小封装(约 0.6 mm × 0.3 mm),便于高密度布局。
  • 可靠的电流容量与阻抗特性:250 mA 额定电流,DCR ≈700 mΩ;在直流偏置与高频下表现可控。

三、典型应用

  • 手机及无线终端的射频匹配网络、偏置隔离与谐振电路。
  • Wi‑Fi、蓝牙、GPS、LTE 等通信模块的滤波与阻抗调节。
  • 高频滤波、EMI 抑制、输入/输出匹配及高速接口的去耦元件。
  • 小型化射频模块、IoT 终端与可穿戴设备等空间受限场合。

四、设计与布局建议

  • 布局时保持引脚到器件的走线最短,减少寄生电感与电容带来的性能偏移。
  • 避免器件附近有过大铜箔或不对称焊盘,以免改变特性。
  • 0201 体积极小,焊膏用量与回流曲线需严格控制,防止焊接缺陷与 tombstoning。
  • 工作电流接近额定值时注意温升与功率耗散,必要时做电流降额设计。
  • 射频设计中建议使用网络分析仪测量实际布局下的 S 参数并微调电感值。

五、检验与替换注意

  • 典型测试方法:LCR 表在适当频率测量电感与 DCR;网络分析仪测量频率响应与 SRF。
  • 可参考其他知名厂商的同类小型高频电感作为替代,但应逐项比对电感值、SRF、Q、DCR 与封装尺寸以免影响电路性能。

六、采购与可靠性

  • 建议关注包装形式(卷带)与湿敏等级(MSL),并按厂方推荐的储存与回流工艺操作。
  • 小封装对贴装精度、焊膏印刷与回流控制要求高,生产中应加强过程控制与首件检验。

该器件在要求小体积且需良好高频特性的场合具有明显优势,选型时请结合实际电流、频段与电路布局进行综合评估。

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