Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GRM1885C1H103JA01D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM1885C1H103JA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM1885C1H103JA01D
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0135726472
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：GRM1885C1H103JA01D（村田贴片电容）
一、基本信息
产品名称：GRM1885C1H103JA01D
品牌：muRata（村田）
类型：多层陶瓷电容（MLCC）
电容值：10,000 pF（10 nF）
额定电压：50V
容差：±5%
温度系数：C0G（NP0）
工作温度范围：从-55°C 至 125°C
封装/外壳：0603（1608公制）
尺寸：0.063" 长 x 0.031" 宽（1.60mm x 0.80mm）
最大厚度：0.035"（0.90mm）
安装类型：表面贴装（SMD）
二、产品特性
GRM1885C1H103JA01D是村田公司生产的一款高性能多层陶瓷电容器，广泛应用于各类电子设备的电路设计中。这款电容器具有以下特点：
高稳定性：C0G（NP0）温度系数使得该电容具有优异的电气特性和稳定性，特别是在温度变化范围内，电容值几乎不变，适合对电性能要求严苛的高频电路。
小型化设计：0603封装尺寸使得这款电容器在电路板上占用极小的空间，有助于实现设备小型化设计，是现代电子产品设计中不可或缺的一部分。
广泛的工作温度范围：支持-55°C至125°C的工作温度，使得该电容器能够适应各种环境条件，适合在工业级和汽车级应用中使用。
良好的容差控制：±5%的容差提供了良好的电容稳定性，使得电路在工作中表现出色。
高电压等级：额定电压为50V，使得该电容能够广泛应用于许多需要较高电压的电路场合，进一步扩大了其适用范围。
三、应用场景
GRM1885C1H103JA01D适用于多种电子产品和应用，包括：
消费电子：诸如智能手机、平板电脑、便携式音响等设备中，用于滤波和耦合电路，以提高声音质量和信号传输性能。
通讯设备：适用于无线通讯和网络设备中，帮助实现高频信号处理，保证信号的完整性和稳定性。
汽车电子：在汽车电子系统中，尤其是在EMC（电磁兼容）设计领域，由于其高温和高电压的适应能力，成为关键部件之一。
工业控制：在自动化设备和工业控制系统中，GRM1885C1H103JA01D电容用于电源管理和信号处理，确保系统的稳定运行。
四、总结
GRM1885C1H103JA01D作为一款高性能、多功能的贴片陶瓷电容器，以其小巧的0603封装、高稳定性及宽广的工作温度范围，已成为当今电子设计师优先选择的产品之一。它不仅满足了现代电子产品在小型化和高性能方面的需求，同时也保证了在各种严苛环境下的可靠性。这使得GRM1885C1H103JA01D在无线通讯、消费电子、汽车电子及工业应用等领域具有极高的价值和重要性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
