WMSIC Electronic Components

muRata GJM1555C1H1R8BB01D

ModelGJM1555C1H1R8BB01D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
mu Rata GJM1555C1H1R8BB01D
Type
MURATA
Unit
Electronic Component
Minimum package
10000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GJM1555C1H1R8BB01D
Electronic Component
1
Electronic Component
1.8pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0227646439
Electronic Component
C0G
Voltage
50V
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:GJM1555C1H1R8BB01D贴片电容(MLCC)

概要

GJM1555C1H1R8BB01D 是由村田(muRata)生产的一款高性能贴片电容(MLCC),专为RF、微波和高频应用设计。以下是该产品的详细介绍。

基础参数

  • 电容值:1.8 pF
  • 容差:±0.1 pF
  • 电压 - 额定:50 V
  • 温度系数:C0G,NP0
  • 工作温度范围:-55°C ~ 125°C

特性

  • 高Q值:该电容器具有高Q值,这意味着它在高频应用中具有低损耗和高效率。
  • 低损耗:低损耗特性使其特别适合用于需要最小能量损失的应用场景。
  • C0G/NP0 温度系数:C0G和NP0温度系数表示该电容器在广泛的温度范围内保持稳定的电容值,适用于要求严格的环境。

应用场景

  • RF和微波应用:由于其高Q值和低损耗,GJM1555C1H1R8BB01D非常适合用于射频(RF)和微波电路中,如滤波器、匹配网络和振荡器。
  • 高频应用:在高频电子设备中,例如通信设备、卫星通信系统和医疗设备等,需要高精度和稳定性的电容器。

安装类型和封装

  • 安装类型:表面贴装(SMT)
  • 封装/外壳:0402(1005 公制)
    • 尺寸:0.039" 长 x 0.020" 宽(1.00mm x 0.50mm)
    • 厚度(最大值):0.022"(0.55mm)

品牌和质量保证

  • 品牌:村田(muRata),一家全球知名的电子元器件制造商,享有良好的声誉和质量保证。

使用优势

  • 小尺寸:0402 封装使得该电容器非常适合用于空间有限的现代电子设备。
  • 高可靠性:村田的生产质量控制确保了该产品在各种环境条件下都能保持高可靠性。
  • 广泛适用性:从消费电子到工业控制系统,GJM1555C1H1R8BB01D 都可以找到广泛的应用场景。

技术支持和文档

村田提供全面技术支持,包括详细的数据手册、应用笔记和设计工具,以帮助工程师快速完成设计和验证过程。用户可以通过官方网站或联系当地代理商获取这些资源。

环境和社会责任

村田致力于环境保护和社会责任。GJM1555C1H1R8BB01D 符合 RoHS 指令,确保产品不含有害物质,如铅、汞、镉等。同时,村田也遵守其他相关法规和标准,以确保产品的安全性和可持续性。

总结

GJM1555C1H1R8BB01D贴片电容是村田为RF、微波和高频应用设计的一款高性能产品。其高Q值、低损耗、稳定的温度系数以及小尺寸封装,使其成为这些领域的理想选择。结合村田的质量保证和技术支持,这款产品无疑是工程师们在设计高性能电子系统时的首选。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.