Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM1555C1HR30BA01D 是由知名制造商 Murata Electronics(村田电子)生产的一款多层陶瓷电容器(MLCC),属于 GRM 系列。该产品专为表面贴装技术(SMT)设计,具有优异的性能和可靠性,适用于各种电子应用。
高稳定性: GRM1555C1HR30BA01D采用C0G(NP0)温度系数,该类型电容器在各种温度范围内具有极低的电容变化,适合高精度要求的电路。
低介质损耗: 此电容器具有优良的介质特性和极低的等效串联电阻(ESR),确保其在高频应用中的高效能。
小型化设计: 封装尺寸为0402,使得该电容器非常适合空间受限的电子设备,如便携式设备、智能手机、平板电脑及其他小型电子产品。
广泛的温度工作范围: 该电容具有-55°C 到 125°C 的工作温度范围,确保其能够在严酷的环境中稳定运行,这使得它在工业、汽车和航空航天等领域具备良好的应用潜力。
通用应用: GRM1555C1HR30BA01D 适用于各种基础电子电路,如滤波、阻抗匹配、耦合与去耦,能够满足通用电子应用的需求。
GRM1555C1HR30BA01D 广泛应用于:
GRM1555C1HR30BA01D 是一款高性能的多层陶瓷电容器,结合了小型化设计、出色的温度稳定性能以及可靠的工作特性,非常适合在专业和工业应用中使用。无论在一般电子设计还是高端技术应用中,该元件都能够提供优越的性能,其低介质损耗和广域的工作温度使其在各种环境下都能保持卓越的可靠性。对于寻求高度可靠和高性能电容器的设计师来说,GRM1555C1HR30BA01D 将是一个理想的选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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