WMSIC Electronic Components

muRata GRM0335C1H101FA01D

ModelGRM0335C1H101FA01D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM0335C1H101FA01D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM0335C1H101FA01D
Electronic Component
1
Electronic Component
100pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±1%
Electronic Component
0.024g
Electronic Component
1
Electronic Component
BM0257268131
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM0335C1H101FA01D 产品概述

一、产品简介

GRM0335C1H101FA01D 为村田(muRata)推出的高稳定性贴片多层陶瓷电容(MLCC),规格为 100 pF ±1%,额定电压 50 V,温度特性为 C0G(俗称 NP0),封装为 0201。该器件属于低介电损耗、高频性能优异的 C0G 系列,适用于对温漂、频率响应和线性度有严格要求的电路。

二、主要电气参数

  • 标称电容:100 pF
  • 容差:±1%(高精度)
  • 额定电压:50 V DC
  • 温度系数:C0G(NP0,温漂极小,典型 ±30 ppm/°C)
  • 封装:0201(约 0.6 mm × 0.3 mm)
  • 工作温度范围:常见 -55°C 至 +125°C(请以厂家数据表为准)
  • 介质损耗与漏电:C0G 型介质损耗极低、等效串联电阻/电感小,电压依赖性微弱,适合高频与精密模拟应用。

三、性能特点

  • 温度稳定性优异:C0G 材料确保在宽温度范围内电容变化极小,适用于时基、滤波、参考网络等对温漂敏感的电路。
  • 高频特性好:低介电损耗与低等效串联电感(ESL),在射频和高速信号路径中可保持高 Q 值与良好相位特性。
  • 高精度:±1% 容差适合精密滤波、匹配与采样保持电路,降低后级调校工作量。
  • 小型化:0201 超小封装便于高密度布局,有利于移动设备、可穿戴和空间受限的电子产品设计。
  • 可靠性高:多层陶瓷结构、非极性,适合常规回流焊工艺,长期稳定性好。

四、典型应用场景

  • 精密时钟与振荡器电路的耦合与定时网络
  • ADC/DAC 的采样/保持与参考旁路,提升转换精度
  • 射频匹配网络、高 Q 滤波器与输入/输出耦合
  • 低噪放大器的输入去耦与滤波,保证信号完整性
  • 移动设备、可穿戴电子、无线通信模块等对体积与性能有双重要求的产品

五、封装与焊接建议

  • 由于封装极小,PCB 焊盘设计要参照村田推荐的 land pattern,避免焊膏过多或过少导致虚焊或桥接。
  • 推荐采用标准回流焊曲线(参考厂商数据表),避免重复高温暴露。
  • 处理与贴装时注意防潮与防静电,0201 器件容易丢失或受机械应力影响,建议使用自动贴装与显微检视。
  • 对于高可靠性设计,应考虑清洗流程与残留物对性能的可能影响,必要时与厂商确认清洗兼容性。

六、选型与替代建议

若需相同电性能但不同尺寸或额定电压,可在村田其他 C0G 系列中寻找相应替代型号;同类替代厂商包括 TDK、KEMET 等的 C0G/NP0 产品。选型时应关注:温漂等级、频率响应、ESL/ESR、封装尺寸与焊盘匹配,以及工作电压与环境温度范围。

如需该型号的详细机械尺寸、最大额定电流、频率特性曲线或可靠性测试数据,建议参考村田官方数据手册或提供具体电路应用以便进一步评估。

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