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muRata GRM0335C1H1R8BA01D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GRM0335C1H1R8BA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1H1R8BA01D
- Electronic Component
- 1
- Electronic Component
- 1.8pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0230260861
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM0335C1H1R8BA01D 产品概述
一、产品简介
GRM0335C1H1R8BA01D 为村田（muRata）出品的一款贴片多层陶瓷电容（MLCC），额定容量 1.8 pF，额定电压 50 V，温度特性为 C0G（又称 NP0），封装为 0201（极小尺寸）。此类电容以温度稳定性好、损耗小、频率特性优异著称，适合高频及精密电路中的小容量应用。
二、主要特性
- 电容量：1.8 pF，适用于微小耦合、匹配及谐振电路。
- 额定电压：50 V，满足一般射频和模拟前端的电压需求。
- 温度系数：C0G（0±30 ppm/°C 级别），温度稳定性高，几乎无电容漂移。
- 封装：0201，体积极小，有利于高密度 PCB 布局。
- 低介质损耗、良好 Q 值，抗偏压特性优异（C0G 几乎无偏压效应）。
三、典型应用场景
- 射频前端匹配网络、滤波器与谐振器；
- 高频耦合、旁路与输运网络中的定容或调谐元件；
- 高频计时、振荡电路中的稳定元件；
- 精密模拟电路中要求低温漂与低损耗的小电容。
四、布局与安装建议
- 采用贴片工艺与自动贴装（pick-and-place）为宜，0201 尺寸人工焊接难度大；
- PCB 布局时尽量缩短与反馈/信号线的连线长度，采用对称布局以减少寄生；
- 地线回路应尽可能短且靠近以降低共模干扰，必要时在近端加小型接地过孔；
- 在高频匹配网络中注意与邻近元件的间距，避免电磁耦合干扰。
五、焊接与可靠性注意
- 推荐使用无铅回流焊工艺，遵循厂商及 IPC 标准的回流曲线；
- 0201 尺寸对焊料量与焊盘设计敏感，须优化锡膏层厚度与焊盘尺寸；
- 避免在高机械应力位置焊接或进行后续波峰/手工修复操作，以防裂纹或剥离；
- 存储与运输时注意防潮、防振，长期库存建议密封包装并控制环境湿度。
六、选型与替代建议
- 若需更大电压或不同温度系数，可参照村田同系列或其他品牌（TDK、KEMET）相近规格产品；
- 对于对体积更敏感或需更大电容的场合，可考虑更小或更大封装与不同介质等级的替代件；
- 在关键应用中，选型时请以厂商数据表为准，留足电容公差与稳定性裕量。
七、结语（使用提示）
GRM0335C1H1R8BA01D 以其 C0G 稳定特性与极小封装，适合高频与精密场合的微小电容需求。在工程应用中，请结合实际频率、偏压和制造工艺验证性能，并遵循村田官方资料与 PCB 制造规范以确保长期可靠性。若需详细电气参数、尺寸图与回流曲线，请参考村田产品规格书或联系授权经销商获取最新资料。
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