WMSIC Electronic Components

muRata LQM18DN100M70L

ModelLQM18DN100M70L
Package0603
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata LQM18DN100M70L
Type
MURATA
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
LQM18DN100M70L
Electronic Component
1
Package
0603
Electronic Component
SMD Inductor
Electronic Component
±20%
Electronic Component
0.023g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0228786160
Current
300mA
Frequency
32MHz
Resistor(DCR)
1.365Ω
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LQM18DN100M70L 产品概述

一、产品简介

LQM18DN100M70L 为 muRata(村田)生产的一款贴片电感,封装为 0603(L×W ≈ 1.6 × 0.8 mm)。标称感值 10 μH,公差 ±20%,适用于空间受限的表贴电路中作为滤波及电磁干扰抑制元件。该料号体积小、易于拾放、适配贴片工艺,常用于消费电子、通信模块和小型电源滤波网络。

二、主要参数与物理特性

  • 电感值:10 μH(±20%,实际范围约 8–12 μH)
  • 额定电流:300 mA(按照温升或制造商规定的电流限值)
  • 饱和电流 Isat:100 mA(在该电流附近电感量开始明显下降)
  • 直流电阻 DCR:1.365 Ω(较高,影响直流压降与功耗)
  • 自谐振频率 SRF:32 MHz(在此频率附近电感与寄生电容共振)

三、电气性能解读

  • 公差 ±20% 表示最终电路中感值会有较大波动,适合对感值精度要求不高的滤波用途。
  • DCR 1.365 Ω 较大,直流通过时会产生显著压降与功耗:
    • 100 mA 时压降 ≈ 0.1365 V,功耗 ≈ 13.7 mW;
    • 300 mA 时压降 ≈ 0.4095 V,功耗 ≈ 123 mW(但在 300 mA 时电感已可能进入饱和,实际感量会下降)。
  • Isat(100 mA)为电感开始饱和的参考值,超过该电流后电感量将显著降低,因此在需要维持稳定感量的场合应避免长期工作在该电流以上。
  • SRF 32 MHz 表示在高频(靠近或高于此频率)电感会丧失感性特征并出现谐振,滤波设计时应保证工作频段低于 SRF 以保持预期阻抗特性。

四、典型应用场景

  • EMI/射频干扰抑制(输入/输出滤波)
  • 低频信号的阻抗元件或小功率 DC 线滤波器
  • 便携设备、传感器模块中对体积和高度有限制的滤波场合
    不建议用于高电流、功率型电感或高 Q 值射频谐振电路。

五、选型与使用建议

  • 若电路工作电流接近或超过 100 mA,应注意感值下降,必要时选用 Isat 更高或 DCR 更低的型号。
  • 对于要求较小压降和低功耗的电源路径,应优先选择 DCR 更低的电感;本件 DCR 较高,适合对直流压降不敏感的滤波场合。
  • 在设计时考虑感值公差,若滤波截止频率对精度敏感,应通过调整电容或选用更高精度电感来补偿。
  • 高频应用需避开 SRF 附近频段,或采用专用高频电感/磁珠。

六、封装与生产注意事项

  • 0603 小封装对贴装、焊接与机械应力较敏感,建议采用适当的回流焊曲线并遵循厂商的焊接资料。
  • 防止过大的机械弯曲或敲击,避免元件断裂或性能退化。
  • 过流导致的发热和长期高温会使电感特性变化,应进行热管理与必要的电流余量设计。

七、可靠性与测试关注点

  • 推荐在实际应用条件下进行电感值随电流曲线测试(L vs I)、温度漂移测试与损耗评估。
  • 对于关键产品,应进行温升测试与长期老化试验,确认在额定工况下的稳定性。

总结:LQM18DN100M70L 为一款体积小巧、适用于通用滤波与 EMI 抑制的 10 μH 贴片电感。设计时需重点考虑其较高的 DCR、较低的饱和电流与自谐振频率,以确保在目标应用中获得预期的滤波效果和可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.