Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM1555C1H180GA01D是一款由著名电子元件制造商村田(muRata)生产的表面贴装多层陶瓷电容器(MLCC)。其规格参数为电容值18pF、容差±2%、额定电压50V,具有良好的温度特性和稳定性。此电容器采用0402封装(1005公制),尺寸为1.00mm x 0.50mm,最大厚度为0.55mm,专为高密度电路板设计,适用于各种电子应用场合。
GRM1555C1H180GA01D在多个电子应用领域中表现出其卓越的性能,特别适合以下应用场合:
GRM1555C1H180GA01D的0402封装(1005公制)是极为常见的表面贴装组件(SMD)中的一种,适合于现代电子设备的微型化设计。小尺寸使其能够容易安装在高密度PCB(印刷电路板)上,这对于智能手机、平板电脑、可穿戴设备和其他小型电子产品至关重要。同时,表面贴装技术(SMT)也降低了生产成本,提高了装配的自动化水平。
总的来说,GRM1555C1H180GA01D是一款高性能、宽应用范围的电容器,以其小巧的0402封装和出色的电子特性脱颖而出。凭借其优异的温度系数和高稳定性,使其非常适合在高频和高稳定性需求的应用中使用。村田凭借其在电子元器件领域的强大背景和经验,为客户提供了可靠的选择,使得GRM1555C1H180GA01D成为实现电子创新和提高产品性能的重要组成部分。无论是在消费电子、工业设备还是通信领域,这款电容器都将展现出良好的应用效果和价值。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products