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muRata GJM1555C1HR90BB01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- mu Rata GJM1555C1HR90BB01D
- Type
- MURATA
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GJM1555C1HR90BB01D
- Electronic Component
- 1
- Electronic Component
- 0.9pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0257273460
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GJM1555C1HR90BB01D 产品概述
一、产品简介
GJM1555C1HR90BB01D 为村田（muRata）生产的贴片多层陶瓷电容（MLCC），标称容值 0.9 pF，额定电压 50 V，温度系数为 C0G（又称 NP0），封装为 0402（约 1.0 × 0.5 mm）。该型号以尺寸小、温度稳定性好、介质损耗低著称，适合高频与高稳定性要求的电路使用。
二、电气性能要点
- 容值：0.9 pF，适用于微小电容需求的匹配、谐振与补偿电路。
- 额定电压：50 V，日常信号和射频线路足够。
- 温度系数：C0G（0 ±30 ppm/°C 级别），温度依赖性几乎可忽略，长期稳定性优良。
- 介质损耗低，品质因数高，适合高频、射频和精密模拟应用。具体容差和介质损耗等参数请以厂方数据表为准。
三、典型应用场景
- 射频匹配网络与滤波器（VCO、LNA、天线调谐）。
- 高频耦合、阻容网络与谐振回路。
- 精密时钟、定时及参考电路中要求温漂小的场合。
- 测量仪器、传感接口的微小电容补偿与调节。
四、封装与可靠性
0402 封装适合高密度 PCB 设计，对机械应力相对敏感，应避免板材弯曲和过度机械碰撞。村田产品通常通过严苛的可靠性测试（如温度循环、湿热与振动测试），但具体合格标准与寿命数据应参照最新数据表与检验报告。
五、选型与布局注意事项
- 高频电路中应将电容与相关器件尽量靠近并缩短走线，减少寄生电感与串联电阻。
- 对于对容值精度有严格要求的场合，务必确认容差与温漂，并考虑批次一致性。
- 尽量避免在焊盘上施加过大焊膏量或引脚间形成过大热梯度，防止热应力导致微裂纹。
- 如对抗 DC 偏置敏感，请参考厂方曲线评估在实际偏置下的容值变化，C0G 类型在 DC 偏置下变化极小。
六、焊接与储存建议
建议按厂方推荐的回流焊曲线进行无铅或有铅回流，控制峰值温度、保温时间及升降温速率以降低裂纹风险。元件应保持原包装储存，遵循防潮与回流前干燥处理要求。
七、质量与测试
在量产前应进行来料检验，包括外观、X/Y 外形尺寸、容值与损耗、击穿电压及绝缘电阻等。对关键射频或计时电路，建议做实际频域测试以确认自谐振频率与 Q 值满足设计要求。
备注：本文旨在提供产品特性与应用建议，具体电气规格、容差及可靠性数据请参照村田正式数据表与技术支持。
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