Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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GRM32ER71A476KE15L 是由著名电子元件制造商村田(muRata)生产的一款多层陶瓷电容器(MLCC)。该产品具有以下核心特点:容量为 47µF,额定电压为 10V,采用 X7R 介质材料,具备良好的温度稳定性和电性能。其封装形式为1210(3225公制),适合表面贴装,方便在现代电子器件中应用。
电容量与电压:GRM32ER71A476KE15L 的标称容量为 47µF,额定电压达到 10V,适用于多种电源及信号处理应用。这个电容量和电压尤其适合于需要低 ESR(等效串联电阻)、高频性能和较大储能的电路设计。
温度系数:该电容器使用 X7R 介质材料,提供-55°C 到 125°C 的工作温度范围。在这个范围内,电容器的电容量变化不超过 ±15%,使其在极端环境下也能保持良好的性能,确保其在苛刻条件下的可靠性。
尺寸与封装:GRM32ER71A476KE15L 的封装为 1210(3225 公制),尺寸为 3.20mm x 2.50mm x 2.70mm,属于小型化产品,这使得其适合于空间有限的应用场景,例如手机、平板电脑及各类便携式电子设备的主板设计。
容差:该电容器的容差为 ±10%,可以满足不同电路的精确需求。尽管容差范围相对较宽,但对于许多应用而言,足以保证稳定性和可靠性。
GRM32ER71A476KE15L 电容器广泛应用于各种电子设备中,比如:
村田作为一家知名的电子元器件制造商,以其高品质的产品著称。GRM32ER71A476KE15L 在设计上具有优越的稳定性和可靠性。X7R 材料使其在温度变化时能够承受电容量的微小波动,适合于长时间运行的应用。此外,其小型化的设计使其容易集成在各种复杂的电路板布局中,不会影响其他元器件的正常工作。
GRM32ER71A476KE15L 是一款功能强大、性能稳定的多层陶瓷电容器,凭借其高容量、适宜的电压规格以及出色的温度稳定性,非常适合广泛的电子应用。无论是在消费电子、工业设备还是其他专业领域,GRM32ER71A476KE15L 都能够为设计师和工程师提供可靠的解决方案。
综上所述,GRM32ER71A476KE15L 以其卓越的性能和优秀的制造工艺,成为现代电子设备中不可或缺的关键元器件之一,值得电子工程师和设计师关注和选用。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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