WMSIC Electronic Components

muRata GCJ21BR71H105KA01L

ModelGCJ21BR71H105KA01L
Package0805
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
mu Rata GCJ21BR71H105KA01L
Type
MURATA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GCJ21BR71H105KA01L
Electronic Component
1
Electronic Component
1uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0258707174
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GCJ21BR71H105KA01L 产品概述

一、产品简介

GCJ21BR71H105KA01L 为村田(muRata)生产的贴片多层陶瓷电容(MLCC),规格为 1 µF ±10%,额定电压 50 V,介质型式 X7R,封装 0805(公制 2012)。属于非极性、低等效串联电阻(ESR)的通用型旁路/耦合元件,适用于多种工业与消费类电子电路的去耦、滤波与能量暂存场合。

二、主要电气参数

  • 标称电容:1.0 µF(±10% 初始容值)
  • 额定电压:50 V DC
  • 介质特性:X7R(-55 °C 至 +125 °C,温度变化范围内容差通常 ≤ ±15%)
  • 封装:0805(2012 公制)
  • 极性:无(非极性)

三、关键特性与使用注意

  • 温度特性:X7R 为 Class II 陶瓷,温度范围宽,但随温度变化容值有一定漂移,通常在规定温度范围内容值变化不超过 ±15%。
  • 直流偏压效应:在较高直流偏压下(接近额定电压)实际有效电容量会出现明显下降,具体降幅与片式尺寸、厚度及配方有关,设计时请参考厂方 DC-bias 曲线并留余量。
  • 老化与时间稳定:Class II 陶瓷存在老化现象,容值随时间按对数规律小幅下降(需参见厂方资料获取具体百分比)。
  • 高频特性:MLCC ESR 低、自谐频率高,适合高频去耦和滤波应用,但在精密定容或谐振电路时需考虑介质非线性与偏压影响。

四、典型应用场景

  • 电源去耦与旁路(DC-DC 输入/输出、LDO 降噪)
  • 高频滤波与阻抗匹配网络
  • 耦合/旁路电容、去耦参考平面稳定
  • 空间受限的便携设备与消费电子应用

五、选型与布局建议

  • 若电路对有效电容稳定性要求高(如电源滤波在高偏压下),建议按 DC-bias 曲线留足裕量或选用更高电压等级/更大体积封装。
  • PCB 布局中尽量靠近电源引脚放置,走线要短、宽,减少串联电感。对多颗并联使用,确保焊盘、过孔分布合理以降低寄生。
  • 对于会受机械应力或弯曲的板面,避免将 0805 封装电容置于弯曲区域,防止压裂。

六、焊接与可靠性

  • 按厂商推荐的无铅回流焊曲线进行焊接,遵守湿敏等级(MSL)与焊前烘烤要求。
  • MLCC 对热冲击与机械应力敏感,存储与贴装过程中要避免跌落、弯折与过度振动。必要时在关键应用中可采用封装加固或点胶工艺提升可靠性。

七、采购与替代建议

  • 采购时确认完整料号与包装(卷带/盘装)信息,索取并参照村田最新版数据手册获取 DC-bias、耐久、温度特性与推荐焊盘图。
  • 若需更低偏压依赖或更高容量稳定性,可考虑更大封装(1206/1210)或采用 C0G/NP0 型陶瓷、钽电容或固态铝电解进行替换,视成本与体积权衡。

如需我帮您查找该料号的厂方数据手册、电容随偏压与温度的具体曲线,或提供 PCB 推荐焊盘与回流曲线参数,我可继续提供详细资料。

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