Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata LQW15AN2N5B00D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata LQW15AN2N5B00D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- LQW15AN2N5B00D
- Electronic Component
- 1
- Package
- 0402
- Type
- Display Inductor
- Electronic Component
- Power Inductor
- Electronic Component
- 0.015g
- Inductor
- 2.5nH
- Electronic Component
- 1
- Electronic Component
- BM0058421641
- Current
- 850mA
- Resistor(DCR)
- 50mΩ
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：LQW15AN2N5B00D
LQW15AN2N5B00D 是一款由日本著名电子元件制造商 muRata（村田）推出的高性能功率电感，其设计采用表面贴装型封装（0402），尺寸非常小巧，适合各种高密度电子应用。该产品具有极低的电感值，仅为 2.5nH，并且具备多项优良的电气性能，尤其适用于高频和高性能的电路设计中。
规格参数
- 基本参数
- 类型：绕线
- 材料 - 磁芯：无磁性
- 电感：2.5nH
- 容差：±0.1nH
- 额定电流：850mA
- 屏蔽：无屏蔽
- DC 电阻 (DCR)：最大 50 毫欧
- 不同频率下的 Q 值：20（在 250MHz 测试条件下）
- 自谐振频率：15GHz
- 工作温度范围：-55°C ~ 125°C
- 电感频率 - 测试：100MHz
- 安装类型：表面贴装型
- 封装/外壳：0402（1005公制）
- 尺寸：0.039" 长 x 0.024" 宽（1.00mm x 0.60mm）
- 高度：最大 0.024"（0.60mm）
应用领域
由于其极低的电感值和高自谐振频率，LQW15AN2N5B00D 非常适合用于高速数字电路、射频设备和其他要求严格的应用场合。在移动通信、计算机和消费电子产品中，这款电感器能够在快速变化的信号处理中提供高效的电流平滑和临时储能能力。
性能特点
- 极低的电感值与容差：电感值为2.5nH，使得该电感在高频电路中表现出色，能够满足高数据传输速率的需求。而容差仅 ±0.1nH 进一步确保了其在应用中的稳定性和可靠性。
- 高频特性：在250MHz频率下，Q 值达到20，显示出良好的高频性能，适合在高频信号处理应用中使用。
- 自谐振频率：15GHz的自谐振频率提供了更大的设计灵活性，确保在多种频率下都能够稳定工作。
- 耐温性能：工作温度范围从-55°C到125°C，使得该电感器在极端环境下也能保持良好的性能，适用性广泛。
设计优势
LQW15AN2N5B00D的0402封装设计非常紧凑，使其适用于现代电子设备的极小化设计需求。其表面贴装的安装方式大大简化了PCB的组装过程，并有效节省了板上空间，符合现代设备对体积和重量的严格要求。
结论
总体而言，LQW15AN2N5B00D 提供了卓越的电气性能和可靠性，为高频和高密度应用设计提供了理想的解决方案。凭借 muRata 在国际市场中建立的良好声誉，它的引入无疑将提升产品的性能和竞争力。这款产品非常适合那些对高频、高效能和可靠性有着严格要求的工程师和设计师们，能够广泛应用于诸如移动通信、网络设备、消费电子及其他高科技产品中。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
