Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM188R60J475KE19D是一款高性能的多层陶瓷电容(MLCC),由知名电子元器件制造商村田(muRata)生产。该电容具备4.7µF的电容值,额定电压为6.3V,并且具有±10%的电容容差,适合多种通用电子应用。这款电容采用X5R温度系数,使其在广泛的温度范围内保持良好的电气特性,尤其在温度变化较大的应用环境中展现出优越的性能。
高稳定性和可靠性:采用X5R陶瓷材料,使得该电容在多种工作条件下都能保持稳定的电容值。X5R电容在-55°C至85°C的广泛温度范围内工作,适合于高温、高湿等复杂环境。
小型化设计:0603封装尺寸使得GRM188R60J475KE19D在进行产品设计时,非常适合用于空间有限的应用。小型封装不仅可以节省PCB空间,同时也对实现高密度安装的电子设备非常关键。
多功能性:这款电容被广泛应用于各种通讯设备、消费电子产品、计算机硬件以及工业设备等多个领域。无论是在滤波、去耦还是能量存储应用中,GRM188R60J475KE19D都能提供出色的性能。
良好的电气性能:该电容具备优异的ESR(等效串联电阻)和ESL(等效串联电感),可降低信号失真,提高高频电路的效率。此外,其耐压特性也使得该电容能够稳定地运行于额定电压下,不会轻易击穿。
GRM188R60J475KE19D广泛应用于:
GRM188R60J475KE19D是一款高性能、低ESR、多用途的表面贴装陶瓷电容,凭借其优良的电气特性和适应各种环境的能力,使其在现代电子产品设计中成为不可或缺的组件。无论是在要求严格的工业应用,还是在日常消费电子产品中,GRM188R60J475KE19D都能为用户提供稳定可靠的性能表现,满足多样化的市场需求。选择村田的这款电容,可以有效提高电路的整体性能和可靠性,为设计师带来更多的设计灵活性和选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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