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muRata LQP03HQ1N0W02D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata LQP03HQ1N0W02D
- Type
- MURATA
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- LQP03HQ1N0W02D
- Electronic Component
- 1
- Package
- 0201
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.009g
- Inductor
- 1nH
- Electronic Component
- 1
- Factor
- 20@500MHz
- Electronic Component
- BM0259371983
- Current
- 1.1A
- Frequency
- 16GHz
- Resistor(DCR)
- 40mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LQP03HQ1N0W02D 产品概述
LQP03HQ1N0W02D 为 muRata（村田）系列超小型贴片厚膜电感，封装规格为 0201。该器件以极小封装实现 1 nH 的电感值，适合高频射频前端、微带滤波、匹配网络及紧凑型电路的电感需求。其主要电气参数为：电感值 1 nH；额定电流 1.1 A；直流电阻（DCR）40 mΩ；品质因数 Q = 20（@500 MHz）；自谐振频率（SRF）16 GHz。
一、主要特性与优势
- 超小体积：0201 封装极大节省 PCB 面积，适合空间受限的移动终端、蓝牙/Wi‑Fi/5G 射频模块。
- 高频性能优异：SRF 高达 16 GHz，Q 值在 500 MHz 处为 20，适合高频信号处理与射频匹配应用。
- 低损耗与低 DCR：40 mΩ 的直流电阻配合较高的额定电流，使其在需要较大直流通过同时又要求低功耗场合表现良好。
- 制造工艺：厚膜电感工艺提供良好的批量一致性与可靠性，适配贴片自动贴装与回流焊流程。
二、典型应用场景
- 射频前端匹配与谐振电路（手机、无线模块）
- 高频滤波器、射频陷波与共模抑制器
- 模拟/数字电源的旁路与电流隔离（低值电感场合）
- 紧凑型高频 PCB 设计、天线匹配网络
三、封装与焊接注意事项
- 封装为 0201（约 0.6 × 0.3 mm，为典型尺寸参考），体积极小，贴装和返修需使用精密贴片设备与显微镜辅助。
- 推荐采用标准回流焊工艺；避免手焊以防损伤元件或造成安培压力。
- 焊盘设计应保证焊点对称、焊量受控；贴装后避免强烈弯折或机械应变，防止电感体或端接层裂纹。
四、布局与电路设计建议
- 高频路径尽量缩短引线长度，减少寄生电容与电感，提升实际工作频率与 Q 值。
- 若作为射频匹配元件，靠近器件或天线放置以减少传输线影响。
- 在需要大电流时，考虑与散热、过流保护协同设计，并为电感预留裕量（额定电流为 1.1 A，建议在高温或连续大电流工况下适当降额使用）。
五、测试与可靠性
- 高频参数（Q、SRF）建议使用网络分析仪或高频阻抗分析仪进行测量，测量频点参考 500 MHz 和接近 SRF 的频段。
- 进行温度循环、焊接热冲击和振动测试以验证在目标应用环境下的可靠性。
- 对于关键应用，建议根据实际频带和功率做样件验证，确认在工作频率下的插损、匹配和温升情况。
以上为 LQP03HQ1N0W02D 的产品概述与设计参考。基于具体应用场景（工作频率、功率、温度与封装工艺），在最终电路中应做工程验证以确保满足性能与可靠性要求。若需器件数据手册或封装尺寸图，可联系 muRata 或元器件分销商获取完整规范与样片支持。
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