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muRata GJM1555C1H180GB01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GJM1555C1H180GB01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GJM1555C1H180GB01D
- Electronic Component
- 1
- Electronic Component
- 18pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±2%
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0257274311
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GJM1555C1H180GB01D 产品概述
一、产品简介
GJM1555C1H180GB01D 为 muRata（村田）系列贴片多层陶瓷电容（MLCC），规格为 18 pF ±2%，额定电压 50 V，温度特性 C0G（又称 NP0），封装为 0402（约 1.0 × 0.5 mm）。该型号以容量精度高、温度稳定性好、低损耗和高自谐频率为主要特征，适用于高频与精密电路。
二、主要性能特点
- 容值与精度：18 pF，公差 ±2%，适合对容值精度要求较高的电路。
- 温度特性：C0G/NP0，近零温度系数（典型 ppm 级），在宽温区间保持极小的容差漂移，适合高精度与温度敏感应用。
- 额定电压：50 V，满足常见射频、滤波及定时电路的工作电压要求。
- 电气特性：低介质损耗、较高 Q 值与良好的频率特性，直流偏压下容值稳定性好。
- 封装优势：0402 小型化封装，有利于高密度 PCB 布局并降低寄生电感。
三、典型应用场景
- 射频前端匹配元件、谐振回路与耦合/旁路电容；
- 高频滤波、阻抗整形与时钟/谐振电路；
- 精密模拟电路中的定容元件（参考信号路径、增益设置等）；
- 通信设备、消费电子、微型传感器与可穿戴设备等小型化产品。
四、封装与装配建议
- 0402 尺寸（约 1.0 × 0.5 mm）便于高密度贴装，但对贴装精度与回流工艺要求高；
- 建议遵循厂商推荐的焊盘尺寸与回流温度曲线，采用标准无铅回流工艺并控制温度坡度；
- 未焊前如包装已吸湿超过规定时间，应按村田建议进行烘烤以避免焊接缺陷；
- 布局时注意减少机械应力（避免 PCB 弯曲、接近大热源或螺丝孔）。
五、选型与可靠性要点
- 若需要较高容值或能承受更高偏压，可考虑不同材料体系或更大封装；
- C0G 型电容具有优良的长期稳定性及极小介电老化，适合对稳定性有严格要求的应用；
- 小尺寸封装在抗冲击与焊接可靠性上对工艺要求更高，应重视 PCB 支撑与应力缓解设计。
六、可替代与配套建议
- 在同一系列或同类 C0G/NP0 小封装产品中可寻找等值替代件，但需核对温漂、额定电压与封装尺寸；
- 在射频链路设计中，可与高 Q 电感、微带线匹配网络共同优化频率响应与带宽。
综上，GJM1555C1H180GB01D 为一款面向高频与精密应用的高稳定性 MLCC，适用于对容值精度与温度稳定性有较高要求的场合。在实际应用中，应结合 PCB 工艺与电路需求进行合理选型与布局。
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