WMSIC Electronic Components

muRata LQP03HQ4N3H02D

ModelLQP03HQ4N3H02D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
mu Rata LQP03HQ4N3H02D
Type
MURATA
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
LQP03HQ4N3H02D
Electronic Component
1
Package
0201
Electronic Component
SMD Inductor
Electronic Component
±3%
Electronic Component
0.008g
Inductor
4.3nH
Electronic Component
1
Factor
20@500MHz
Electronic Component
BM0259364959
Current
500mA
Frequency
7GHz
Resistor(DCR)
170mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LQP03HQ4N3H02D 产品概述

一. 产品简介

LQP03HQ4N3H02D 为村田(muRata)系列超小型贴片电感,封装为 0201(极小体积),面向高密度、高频应用。该器件以 4.3 nH 的电感值与 ±3% 的高精度配合,适合用于射频匹配、电源去耦及高频滤波等场合,兼顾体积与性能。

二. 主要电气参数

  • 电感值:4.3 nH
  • 精度:±3%
  • 额定电流:500 mA(DC)
  • 直流电阻(DCR):170 mΩ
  • 品质因数(Q):20 @ 500 MHz
  • 自谐振频率(SRF):7 GHz
  • 封装:0201(贴片)
  • 品牌:muRata(村田)

三. 典型特性与优势

  • 精度高(±3%):适用于需要严格阻抗匹配的射频电路,能降低调试时间与误差。
  • 高频性能优良:Q 值在 500 MHz 有较好表现,SRF 达 7 GHz,能够覆盖从 VHF 到微波频段的部分应用。
  • 小封装优势:0201 大幅节省 PCB 面积,便于用于空间受限的移动设备与微型模块。
  • 额定电流与 DCR 配合:500 mA 额定电流适合小电流电源滤波场景,170 mΩ DCR 说明器件在直流偏置下功耗有限。

四. 典型应用场景

  • 射频前端:阻抗匹配、谐振电路、微带线终端元件。
  • 高频滤波与去耦:移动通信、Wi‑Fi/蓝牙、GPS 与无线模块的带内滤波或旁路元件。
  • 小型电源滤波:对空间敏感的低功耗模块电源去耦。
  • 高频信号链路:作为微小电感元件用于滤波或相移网络。

五. 设计与封装注意事项

  • 高频设计时注意器件的自谐振频率,工作频率接近或超过 SRF 时电感将失效并呈现电容性。
  • 布局时尽量缩短与电感相连的走线,避免与大电流回路或噪声源并行,以减少串扰与寄生影响。
  • 0201 封装非常小,贴装与回流焊要求更严格,请采用与村田推荐一致的焊接工艺参数并确认回流曲线。
  • 在靠近敏感射频通道时留意邻近器件的磁耦合,必要时调整布局或增加屏蔽。

六. 可靠性与测试建议

  • 在最终设计中建议进行实际频率点的 S 参数测量与功率/温升测试,以确认器件在工作电流下的电感漂移与损耗。
  • 对于振动、热循环等环境因素,应按产品使用环境进行验证,尤其是贴片强度与焊后可靠性测试。
  • 如需长期稳定性或在偏高温度/电流下使用,建议参考村田的完整规格书并与供应商确认应用限制。

七. 选型与采购建议

  • 若设计对损耗要求更高或需要更大电流能力,可考虑更大封装或低 DCR 的替代型号。
  • 在批量采购前建议先采购样片进行 PCB 实测,确认电磁兼容及匹配性能。
  • 如需替代或同类比较,请以电感值、Q 值、SRF、DCR 与额定电流为主要对比项,并优先参考原厂规格书与应用注意事项。

如需该型号的详细频率响应曲线、封装尺寸或回流焊推荐曲线,可提供进一步要求,我将基于村田官方资料为您整理关键参数与测试建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.