Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GRM155R61E104KA87D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM155R61E104KA87D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM155R61E104KA87D
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0254034880
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：GRM155R61E104KA87D
一、产品基本信息
GRM155R61E104KA87D 是一款由日本村田（muRata）公司生产的表面贴装多层陶瓷电容器（MLCC），其主要规格为0.1µF，容差为±10%，额定电压为25V，并采用X5R温度系数。该型号的封装类型为0402，适用于各种电子应用。
二、结构和材料
GRM155R61E104KA87D 使用先进的陶瓷材料进行制造，具备较高的介电常数，使其可以在较小的封装中实现较高的电容值。X5R温度系数的选用意味着该电容在-55°C至85°C的温度范围内能够保持良好的电容稳定性，适合在温度波动较大的应用环境中使用。
三、重要参数
- 电容: 0.1µF（或100nF），在高频信号和滤波应用中非常适用。
- 容差: ±10%，提供了一定的灵活性和可靠性，符合多种设计需求。
- 额定电压: 25V，适合在低电压或小信号电路中使用。
- 温度系数: X5R，确保其在较宽的温度范围内表现出优良的电容稳定性。
- 工作温度: -55°C至85°C，满足多种恶劣环境应用的需求。
- 封装: 0402（1005公制），体积小巧，适合高密度电路板设计，节省板面空间。
四、应用领域
GRM155R61E104KA87D 电容器的多种优良特性使其适用于广泛的应用场景，包括但不限于：
- 消费电子产品: 例如手机、平板电脑和笔记本电脑中用于滤波和去耦。
- 汽车电子: 在汽车电路中提供稳定电源和信号滤波的能力。
- 工业设备: 在各类工业控制系统中用作噪声抑制和电源去耦应用。
- 通信设备: 在信号处理和变换环节中使用，保证信号的稳定性。
五、产品优势
- 小型化设计: 0402的封装规格使其在设计中极具灵活性，有利于紧凑型设备的开发。
- 可靠性高: 村田作为全球知名的电子元器件制造商，其产品具有高品质的保证，长期使用过程中不易发生故障。
- 温度特性优异: X5R材料确保在温度变化时，电容值变化小，适合高效且稳定的电路设计。
六、注意事项
在使用GRM155R61E104KA87D电容时，建议注意以下几点：
- 确保电压在额定值以内，避免因超过额定电压而导致电容失效。
- 在高频应用中，应注意电容的ESR（等效串联电阻）和 ESL（等效串联电感），以确保电路性能。
- 强烈建议在pcb布线中减少电容与其连接点的距离，以减少寄生电容的影响。
七、总结
GRM155R61E104KA87D 电容器凭借其优异的参数范围、高可靠性和广泛的应用适用性，是现代电子电路设计中的一款理想选择。无论是在日常消费类电子产品的研发，还是在对环境要求较高的工业及汽车应用中，它都能提供卓越的性能保障。选择村田的这款电容，将为您的项目方案带来极大的便利和稳定性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
