Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata LQP03TNR10J02D
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata LQP03TNR10J02D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- LQP03TNR10J02D
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Inductor
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Inductor
- 100nH
- Electronic Component
- 1
- Factor
- 8@300MHz
- Electronic Component
- BM0058417946
- Current
- 80mA
- Frequency
- 900MHz
- Resistor(DCR)
- 10Ω
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LQP03TNR10J02D 产品概述
一、产品概况
LQP03TNR10J02D，品牌：muRata（村田），为0201规格的贴片电感器。标称电感值为100 nH，精度±5%，直流电阻（DCR）为10 Ω，品质因数Q = 8（测量频率300 MHz），自谐振频率（SRF）约为900 MHz，额定直流电流80 mA。该器件体积极小，适合对空间要求严格且需兼顾高频性能的小型化电子产品。
二、关键参数解析
- 电感值：100 nH，±5%公差，适用于中高频滤波与阻抗匹配场合。
- 直流电阻：10 Ω，较高的DCR意味着直流通流损耗和压降较大，需在电流较小或容许发热的电路中使用。
- 品质因数：8@300 MHz，表示在300 MHz附近具有中等Q值，适合用于射频滤波、去耦与阻带设计。
- 自谐振频率：900 MHz，表明器件在此频率以上电感特性开始被寄生电容主导，不宜在SRF附近或更高频段作为理想电感使用。
- 额定电流：80 mA，持续通过时会产生I^2·R损耗（例如在80 mA下，功耗约为0.08^2×10 = 0.064 W，即64 mW）。
三、设计与使用建议
- 电流与热管理：建议长期工作电流按额定值进行降额（常见降额范围60–80%），以控制温升并延长可靠性。
- 布局与焊接：0201封装对PCB焊盘和贴装精度要求高，推荐采用细间距贴片工艺和适当的焊膏量，避免过多机械应力或重复回流。
- 高频特性注意：在接近SRF（900 MHz）时电感性质变化显著，进行滤波或匹配设计时应考虑器件S参数或在目标频段测量实际阻抗曲线。
- 损耗计算：在可能的最大电流工况下预估功耗与周边散热能力，必要时增加旁路或降低通过电流。
四、典型应用场景
- 射频前端的滤波与阻抗调整（工作频段在SRF以下）
- 高频去耦与噪声抑制，用于对高频干扰有一定抑制需求的敏感线路
- 空间受限的移动设备、蓝牙/无线模块、手持设备和可穿戴电子产品
五、封装与可靠性提示
0201封装尺寸极小，搬运与贴装应避免弯曲、挤压及过热。存储与焊接应遵循制造商的湿敏等级与回流温度曲线，以降低焊接缺陷与裂纹风险。
六、选型注意与替代考虑
若电路对直流损耗敏感或需要更大工作电流，应优先考虑DCR更低、额定电流更高的同类电感或更大封装型号；若目标工作频段接近或高于900 MHz，应选用SRF更高的元件或考虑薄膜电感/空芯线圈等替代方案。
七、总结
LQP03TNR10J02D是一款面向微型化应用且在数百MHz具有可用Q值的0201贴片电感。其高DCR和有限的额定电流决定了在功率受限或大电流场合需谨慎使用；在射频滤波、小信号去耦和空间受限的移动设备中可发挥优势。设计时应关注电流降额、热量计算及接近SRF时的频率响应。若需最终电路性能保证，建议在目标频段进行实测验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
